Industry News | 2009-03-18 14:23:09.0
Fine Line Stencil will introduce the UltraSlic™ FG solder paste stencil, which sets new stencil performance standards, in booth 846 at the upcoming APEX 2009 exhibition & conference, scheduled to take place March 31-April 2, 2009 in Las Vegas.
Industry News | 2012-09-13 19:50:44.0
Tropical Stencilwill highlight its Laser Cut Stencil and E-formed, Nickel and Stepped Stencils, along with its full line of printed circuit boards in booths #504 and #215 at the upcoming SMTA International Conference and Expo
Industry News | 2012-09-24 16:23:06.0
Tropical Stencil, a leading provider of laser cut stencils, recently has added several new product enhancements, along with full service printed circuit board (PCB) sourcing.
Technical Library | 2013-06-20 14:33:12.0
With today's consumer technologies driving the need for denser and more compact devices, the assembly process for surface mounted devices has becoming increasingly more difficult. With the mixture of components requiring a broader range of print deposition volume, various techniques are in use in an attempt to ensure consistent and appropriate paste volume is achieved. Some of these techniques include step etching a stencil locally on a targeted device, promoting electroformed smooth wall nickel stencils, through to laser cutting newer grade stencil materials. This paper focuses on the relevant attributes that affect the properties of solder paste release and introduces the effects of surface free energy with respect to key elements that make up the stencil printing process.
Industry News | 2008-03-12 15:38:55.0
Fine Line Stencil invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.
Industry News | 2015-10-11 16:19:40.0
Photo Stencil announces that Susan Holmes, VP engineering and customer service for Photo Stencil, will present the paper Stencil Design for Wafer Level Ball Drop and Flip Chip Assembly at the IWLPC during Session 10 on Wednesday, October 14, 2015, at 5:00 PM. The 12th Annual International Wafer-Level Packaging Conference and Tabletop Exhibition is being held at the Doubletree San Jose Airport Hotel, San Jose, CA.
Industry News | 2016-03-10 19:12:32.0
Photo Stencil will showcase advanced stencils for printing the most demanding PCB and semiconductor packaging designs at IPC APEX 2016, Las Vegas, CO, March 15-17, 2016, in booth #825.
Industry News | 2009-04-23 20:18:43.0
Fine Line Stencil has been awarded a 2009 EMAsia Innovation Award in the category of Assembly Line Systems/Equipment for its UltraSlic FG solder paste stencil.
Technical Library | 2021-11-17 18:53:50.0
The demand for product miniaturization, especially in the handheld device area, continues to challenge the board assembly industry. The desire to incorporate more functionality while making the product smaller continues to push board design to its limit. It is not uncommon to find boards with castle-like components right next to miniature components. This type of board poses a special challenge to the board assemblers as it requires a wide range of paste volume to satisfy both small and large components. One way to address the printing challenge is to use creative stencil design to meet the solder paste requirement for both large and small components. ... The most important attribute of a stencil is its release characteristic. In other words, how well the paste releases from the aperture. The paste release, in turn, depends on the surface characteristics of the aperture wall and stencil foil. The recent introduction of new technology, nano-coating for both stencil and squeegee blades, has drawn the attention of many researchers. As the name implies, nano-coated stencils and blades are made by a conventional method such as laser-cut or electroformed then coated with nano-functional material to alter the surface characteristics. This study will evaluate nano-coated stencils for passive component printing, including 01005.
Technical Library | 2017-04-13 16:14:27.0
The drive to reduced size and increased functionality is a constant in the world of electronic devices. In order to achieve these goals, the industry has responded with ever-smaller devices and the equipment capable of handling these devices. The evolution of BGA packages and leadless devices is pushing existing technologies to the limit of current assembly techniques and materials.As smaller components make their way into the mainstream PCB assembly market, PCB assemblers are reaching the limits of Type 3 solder paste, which is currently in use by most manufacturers.The goal of this study is to determine the impact on solder volume deposition between Type 3, Type 4 and Type 5 SAC305 alloy powder in combination with stainless steel laser cut, electroformed and the emerging laser cut nano-coated stencils. Leadless QFN and μBGA components will be the focus of the test utilizing optimized aperture designs.
