Full Site - : electroformed stencil rippling (Page 6 of 18)

FINE LINE STENCIL to Highlight Stencils and Services at APEX 2010

Industry News | 2010-03-30 13:51:24.0

COLORADO SPRINGS, CO - FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, to feature industry leading stencils and services in booth 2317 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.

FCT ASSEMBLY, INC.

Register Now for LPKF’s Stencil Manufacturing Webinar on September 4

Industry News | 2012-08-15 10:30:35.0

LPKF Laser & Electronics will present a live webinar on September 4, 2012 at 11 a.m. PDT.

LPKF Laser & Electronics

FCT Solder to Focus on Lead-Free Projects and Questions with SN100C® Lead-Free Alloy at Productronica 2009

Industry News | 2009-12-07 18:49:39.0

GREELEY, CO — September, 2009 - FCT Solder, a division of FCT Assembly and an authorized Licensee of Nihon Superior Co. Ltd.’s SN100C product line, announces plans to exhibit its popular SN100C® Lead-Free Solder Paste, Bar and Wire and UltraSlic™ FG solder paste stencil in Hall A4 Stand 570 of the upcoming Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.

FCT ASSEMBLY, INC.

FCT Assembly Rolls Out UltraSlic™ Stencil with Nano-Coating

Industry News | 2011-01-31 22:19:11.0

FCT Assembly is pleased to introduce the new UltraSlic™ Stencil with Nano-Coating. The addition of nano-coating to the UltraSlic™ stencil further increases the performance gap between it and any other stencil technology available today.

FCT ASSEMBLY, INC.

FINE LINE STENCIL to Premier New Technologies and Company Updates at APEX 2008

Industry News | 2008-02-28 13:52:30.0

COLORADO SPRINGS, CO � February 2008 � FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, invites visitors to stop by booth 243 at APEX 2008 to learn about its recent positive changes in technology. The APEX exhibition and conference is scheduled to take place April 1-3, 2008 in Las Vegas.

FCT ASSEMBLY, INC.

FCT Assembly’s UltraSlic FG Solder Paste Stencil Wins a 2009 Global Technology Award

Industry News | 2009-11-11 12:24:44.0

GREELEY, CO —FCT Assembly announces that it has been awarded a Global Technology Award in the category of Printing Equipment for its UltraSlic™ FG solder paste stencil. The award was presented to the company during a Tuesday, November 10, 2009 ceremony that took place at the New Munich Trade Fair Center in Munich, Germany.

FCT ASSEMBLY, INC.

FINE LINE STENCIL to Install LPKF ScanCheck System in San Jose Facility

Industry News | 2009-12-14 20:46:02.0

COLORADO SPRINGS, CO — December 2009 — FINE LINE STENCIL, a division of FCT Assembly and a leading manufacturer of stencil products, announces plans to install an LPKF ScanCheck system in its San Jose, CA stencil facility.

FCT ASSEMBLY, INC.

FCT Assembly’s UltraSlic™ FG Stencil Wins a Global Technology Award for Second Consecutive Year

Industry News | 2010-10-29 22:33:47.0

FCT Assembly announces that it has been awarded a Global Technology Award in the category of Printing Equipment for its UltraSlic™ FG Stencil.

FCT ASSEMBLY, INC.

Fine Line Stencil and Metal Etching Technology Announce Merger

Industry News | 2017-07-14 12:20:09.0

Lumberton, NJ - Fine Line Stencil (FLS) and Metal Etching Technology (MET) Associates announce they are merging. The new company will be known as BlueRing Stencils. BlueRing Stencils will maintain 8 manufacturing locations across the USA (TX, NJ, NH, CA, FL, IN, MN & NC). Fred Cox of MET has been appointed President of BlueRing Stencils. Mr. Cox said, “We look forward to providing improved technology and greater service to all of our stencil customers. Our combined companies will allow us to offer the latest innovations in SMT stencil printing.”

BlueRing Stencils

LOCTITE HF 212 Halogen-Free Solder Paste

LOCTITE HF 212 Halogen-Free Solder Paste

New Equipment | Solder Materials

8 hours), and abandon time (>4 hours) Printing: Suitable for high speed printing up to 150 mm/s Reflow: Solderable on challenging surface finishes (CuNiZn and Copper OSP) Colorless residues for easy post-reflow inspection Careful contr

Henkel Electronic Materials


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