Electronics Forum | Thu May 02 07:11:10 EDT 2002 | davef
They probably the same. Most likely someone is saying immersion gold [immersion Au] as a short hand for ENIG [ Electroless Nickel - Immersion Gold]. It is very uncommon to plate gold directly on copper, because gold and copper form a brittle interm
Electronics Forum | Tue Sep 24 23:03:14 EDT 2002 | redmary
we used the ball bonding, just normal chip on board. as I know the the electroless Ni/immersion Au, the gold thickness is about 0.13um at most, what about chemical plating or electrolytic plating? any experience on it, thanks
Electronics Forum | Thu Dec 12 06:38:31 EST 2002 | Roni H.
I need to know basic details about Imersion Tin technology (what is the process, electroless? direct over Cu or over difusion barrier?....). More important is - Does anyone have experience with it? I'll be glad to hear some feedbacks from the "field"
Electronics Forum | Thu Dec 12 07:37:13 EST 2002 | davef
Immersion plating appears like electroless, sorta, but is different chemically. Plating is converting metal ions in solution to metal on the board. Those metal ions are "converted" by adding electrons to them. The source of these electrons defines
Electronics Forum | Mon Feb 21 09:05:46 EST 2005 | davef
We're try to stay away from using electroless nickel. Please describe the differences between the IMC.
Electronics Forum | Mon Feb 21 21:28:13 EST 2005 | abhirami
Davef, We see increased IMC thickness for electroless Ni and the brittle mode failure occurs much earlier in multiple reflows, exposing IMC layers. Not good for board level reliability.Regards. GV
Electronics Forum | Tue Dec 27 10:00:19 EST 2005 | sparrow
Hello, does anybody have experience in thermosonic gold wire bonding to electroless nickel/immersion gold?? regards, Sergey
Electronics Forum | Tue Jun 13 04:42:26 EDT 2006 | yqdeng@gsl.com.hk
What is "Black pad"in ENIG(Electroless nickel/immersion gold), how to solve if it happen in SMD BGA solder joint?
Electronics Forum | Mon Mar 29 14:32:01 EDT 2010 | isd_jwendell
The board in the test "used an electroless nickel/immersion gold (ENIG) finish." If you are not using ENIG plating on your PCBs then you may not suffer from the same issue.
Electronics Forum | Tue Oct 19 05:46:45 EDT 2010 | hhpcb
IR reflow bottom side-> COB Will 2 times IR reflow affect COB bonding process? Appreciate any kind of feedback from you guys..
