Electronics Forum | Tue Aug 18 10:05:11 EDT 1998 | Ben Salisbury
Question: If a PCB and the lands of a part both had electroless plating, would there be a higher tendancy for intermetallics to form in and on the solderjoint...versus just the PCB or Just the part being plated? I'm currently running into this proble
Electronics Forum | Fri Jun 19 14:25:24 EDT 1998 | Earl Moon
| | Has anyone had experience with placing BGA on gold plated boards. I thought I read a while ago there was a problem with embrittlment causing cracked joints. If anyone has experience with this your feedback would be great. | | Mike | There has b
Electronics Forum | Wed Aug 21 10:20:05 EDT 2002 | ksfacinelli
Dave, I am interested in a amine hydrochloride activated flux. Can you give suggestions on readily available fluxes that you have used that have strong deoxidization properties. I am looking at something that could be used in a pinch when the stan
Electronics Forum | Fri Mar 14 23:41:11 EST 2003 | MA/NY DDave
Hi Well maybe someone else has better info yet I don't see this fully associated with density of package. As long as the process gives a good Electroless NI, Immersion AU you should be OK. If it doesn't and the process output is marginal as has been
Electronics Forum | Tue Feb 22 09:01:50 EST 2005 | davef
It could be that you're starting with hyper corroded nickel, before you even begin work. With electroless nickel, everybody looks at the nickel, but the cause turns out to be the immersion gold is too aggressive [during fabrication]. Immersion gold
Electronics Forum | Tue Aug 23 13:10:29 EDT 2005 | davef
We've never heard of this [but all of our gold is electroless, not electrolytic]. If the delamination is caused by the electroylic gold finishing and the via plug process during fabrication, something is wrong. Either your supplier: * Is goofy ...
Electronics Forum | Tue Jan 10 20:56:45 EST 2006 | davef
Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b343900f7010VgnVCM100000f932a8c0
Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef
We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b
Electronics Forum | Mon Nov 13 21:24:19 EST 2006 | davef
You said your gold processing is immersion. More importantly, what is the process used for your nickel? Electroless correct? What is the percent by weight of phosphorus found in your analysis? How many times was the nickel plated? [You should be a
Electronics Forum | Mon Oct 20 15:41:19 EDT 2008 | patrickbruneel
Josh, You can not check the bare boards for black pad unless you remove the gold plating. Like Robin said black pad is nickel oxidation/corrosion and a result from bad electroless nickel plating bath control. The only preventative action you take is
