Electronics Forum | Fri Nov 19 10:56:03 EST 1999 | Kol Chokrotti
chem. Clean ->Electroless Cu ->Clean (hot air)->Electroplating->Inspection. We have checked chemicals, possible contamination and plating current requirements for that specific program�. Everything seems all right. Appreciate if someone could give
Electronics Forum | Fri Jun 18 15:30:38 EDT 1999 | M Cox
What's wrong with the Tin? Just wondering MDCox | | Electroless silver had promise, from Alpha, but I don't know where this ended up. Also Omikron's "white" electroless tin is proported to be a good alternative, though I've never been a big fan of
Electronics Forum | Thu Aug 06 17:25:55 EDT 1998 | Earl Moon
| Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not ele
Electronics Forum | Wed Apr 21 17:08:32 EDT 2004 | dave
Congratulations on your new customer. This could be a keeper. Here's what you're familiar with: Electroless Nickel - per MIL-C-26074 and ASTM-B733. Electroless nickel describes the plating of nickel deposits, which may contain phosphorus and boro
Electronics Forum | Tue Apr 17 08:29:12 EDT 2001 | Geertjan de Beijer
My name is Geertjan de Beijer and I am new on this forum. I have a question about Electroless Nickel/Gold finishes. Until now we always use a HAL finish on our PCB's. Since we are using compontents with pitches of 0.5mm we notice that the HAL finis
Electronics Forum | Tue Feb 01 21:51:05 EST 2000 | Dave F
Roni: Ron gives good advice on the thickness of your Electroless Nickel - Immersion Gold (ENIG) solderability preservative. Several additional comments are ENIG: � More expensive than OSPs and HASL. � Much flatter surface than HASL, similar to OSP
Electronics Forum | Fri Aug 07 07:52:15 EDT 1998 | Earl Moon
| | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not e
Electronics Forum | Tue Aug 15 16:57:54 EDT 2000 | Doug Philbrick
In many threads here I have read and talked about Electroless Gold problems and have experienced my own problems with it. Love to hear what others are doing as a replacement. Is it Electroless tin, is it osp or is HASL good enough for .031 pitch BGA
Electronics Forum | Fri Aug 20 11:24:54 EDT 1999 | Chuck B.
I am being asked, by my vendor and Purchasing people about converting from Tin/lead pads on P.C.B's to Electroless Tin Plating. Can any one tell me what I have to change in my SMT process (paste, reflow, etc) If any? I ran one P.C.Board and I
Electronics Forum | Tue Nov 29 21:51:37 EST 2005 | wmeyers
I have a pin and sleeve assembly that utilizes a fusible link type of solder, Bi, Cd, Pb and Sn alloy. The pin is gold plated, the sleeve is copper alloy 725. I have had sporadic success with wetting of the sleeve during the reflow process. To improv