Electronics Forum | Wed Nov 20 01:38:53 EST 2019 | ajspec
Hi, i'm facing solder mask peel off but limited to the solder defined pad only(opening area). no peel off on the other area and it happened on electroless nickel immersion gold finishing only. for other finishing is not affected. kindly advise if you
Electronics Forum | Fri Feb 09 20:05:15 EST 2001 | benefid
The ENIG process will yield between 3-7 micro inches (110 - 275 microns) of gold over the nickel barrier. This thickness range is pretty much the limit as this is a self limiting displacement reaction process. Once all surface nickel ions are repl
Electronics Forum | Tue Aug 20 18:15:02 EDT 2002 | davef
Haaaaa!!!! Soldering to plastic!!!! An apt analogy!!! I like to compare it to soldering to dirt. Some thing. In fact, you are soldering on nickel, when soldering on many things. It�s just that the gold, er Pd, flash enables the wetting mechanism
Electronics Forum | Tue Feb 01 09:53:58 EST 2000 | Ron Costa
I've been using the Electroless Nickel/Immersion Gold plating process for some time now. Here is what i know: It's very flat and solderable if you hold the board house to the following criteria: 120u inches of Nickel 4-9u inches of Gold What type of
Electronics Forum | Tue Feb 11 22:28:25 EST 2003 | davef
What do you mean by "new information"? On final module testing: * If you have hypercorroded nickel and you detect it during final testing, you'll notice it. * If you have hypercorroded nickel and you don't detect it during final testing, you'll ship
Electronics Forum | Fri May 13 14:08:39 EDT 2011 | eezday
This appears to be black-pad and is often the result of using specs that call for gold plating that is too thick. The black pad is corrosion that is created between the gold and electroless nickel during the gold plating process. This is counter in
Electronics Forum | Wed Feb 10 16:51:01 EST 2010 | flipit
Anyone using ENEPIG electroless nickel electroless palladium immersion gold? Am currently using selectively plated gold 25 micro inches in combo SMT/COB gold ball bonded product. Gold cost has increased over the years. Palladium cost is much lower
Electronics Forum | Wed Aug 12 07:22:52 EDT 1998 | Earl Moon
| | | | | Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated,
Electronics Forum | Thu Apr 27 11:36:53 EDT 2000 | PeterB
Russ, We also use 'immersion silver' and have not had any impact on our processes. In fact there are a number of benefits i.e very flat pads (as good as electroless nickel/immersion gold but much cheaper and less unfriendly to the environment), good
Electronics Forum | Mon Oct 25 16:35:04 EDT 1999 | William
I am pretty sure I am not having a problem w/porous gold or nickel that does not solder. How about electroless versus electrolytic? I thought electrolytic was for goldfingers and such applications. Can you use electrolytic plating for fine pitch a
