Industry Directory | Manufacturer
The Original Manufacturer of smt machines and THT machines since 2003 ,We design the both the software and hardware by ourselves and manufacture in our company , the only one in China who can make the smt machines by itself .
New Equipment | Rework & Repair Equipment
A Simple, Low Cost Solution to Damaged Circuitry PACE Cir-Kit Circuitry Repair Kits are a simple, low cost solution to damaged, lifted or missing circuitry on pc boards, allowing fast repair and modification per IPC 7721. Non-ThermoBond Cir-Kits are
New Equipment | Industrial Automation
Sandy.[mailto:unity@mvme.cn] Sandy.[WhatsApp/Skype/Mobile:+8618020776786] Sandy.[Quote to you within the shortest possible time with our best price] Warranty: up to 12 months Shipping: fast delivery is available NEW+ORIGINAL+IN STOCK+ONE
Electronics Forum | Tue Apr 17 21:19:31 EDT 2001 | davef
Curious. Tell us more about: * Murata solderability protection * Solderability protection on the caps used to replace the Muratas * Reflow profile used with each of the two pastes * Differences in the two pastes
Electronics Forum | Wed Sep 23 07:51:28 EDT 2015 | kkay
We have been experiencing an issue where our Panasonic film caps on a board are losing their rated capacitance. We are well within their recommended reflow specs and no other operation exposes the part to a temp of more than 160°C. The caps will read
Used SMT Equipment | Soldering - Reflow
22”/26” Cap. 60 CM/Minute Heating Oven w/ Encoder. S/N 0401DA1A1-28584 An auction item. Auction: January 13 - 18, 2016
Used SMT Equipment | Soldering - Reflow
Rehm Siflow Model 3300 Reflow Oven, Nitrogen Capable, w/ AEC Application Engineering PSA Series Air Cooled Portable Water Chiller Model PSA-3Q, S/N 30H0107, Armstrong Series HC4000 HumidiLean Humidifier w/ Assoc. Oven Coolers & Filters, Wesco 440-Lb
Industry News | 2018-10-18 10:40:04.0
Via Tent-Holes with Solder Mask
Industry News | 2018-10-18 10:28:01.0
The Future of Embedded Passive Components
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Parts & Supplies | Pick and Place/Feeders
K87-M1199-00X K87-M1199-10X YAMAHA FV Feeder small one-way wheel Other parts: KHY-M9129-00 Sanyo Patch Machine with Cutter 4797L PIN(1011348033) 80004705 Vacuum solenoid valve / vacuum valve 4797A image card 6300853681 RH3 2.5 mm Feeder 80004802
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
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Spherical Cap 12x16mm Feeder Spare Parts 00322501s01 Siemens ASM Siplace Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/75.html
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