Industry Directory | Manufacturer
The Original Manufacturer of smt machines and THT machines since 2003 ,We design the both the software and hardware by ourselves and manufacture in our company , the only one in China who can make the smt machines by itself .
We are one of the leading importers & exporters of electronic components in India. We have the following distibutor ships. PIA KOREA ( Polyster/Mettalize Film caps ) Uppermost electronic Industrie Taiwan ( MOV/NTC/PTC) ELITE Taiwan ( electrolytic cap
New Equipment | Solder Materials
A variety of printed circuit boards require protection of selected board areas during the Surface Finish or Assembly Process. A wide range of PEELABLE SOLDER MASKS, the SD 295X Series including the popular SD 2954 and SD 2955 provide such protection
Electronics Forum | Fri Sep 07 12:19:20 EDT 2007 | guqing
We are having problem to develop lead-free (SAC305) reflow profile for big SMT electrolytic caps. The delta T of the joint of the cap with the rest of the board is too big to fit in the tighter lead-free window. Any suggestions regarding the total pr
Electronics Forum | Fri Sep 07 14:55:25 EDT 2007 | jseagle
Change to through hole or hand solder. we are in the same boat and have not foound a reflow solution. James
Used SMT Equipment | Soldering - Reflow
22”/26” Cap. 60 CM/Minute Heating Oven w/ Encoder. S/N 0401DA1A1-28584 An auction item. Auction: January 13 - 18, 2016
Used SMT Equipment | Soldering - Reflow
Rehm Siflow Model 3300 Reflow Oven, Nitrogen Capable, w/ AEC Application Engineering PSA Series Air Cooled Portable Water Chiller Model PSA-3Q, S/N 30H0107, Armstrong Series HC4000 HumidiLean Humidifier w/ Assoc. Oven Coolers & Filters, Wesco 440-Lb
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Parts & Supplies | Pick and Place/Feeders
KHY-M221A-A0 KGT-M221A-A0 YAMAHA YG12 tank chain gland KHY-M2267-00 YG12 tank chain YS12 towline keel X axis PISCO SP2550 R75 KHY-M2276-S0 YS12 screw X-axis YG12 X-axis screw YG12F YS12F screw guide KHY-M371R-00 RAIL GUIDE 12P YS24 YS100 Feida pl
Parts & Supplies | Pick and Place/Feeders
K87-M1199-00X K87-M1199-10X YAMAHA FV Feeder small one-way wheel Other parts: KHY-M9129-00 Sanyo Patch Machine with Cutter 4797L PIN(1011348033) 80004705 Vacuum solenoid valve / vacuum valve 4797A image card 6300853681 RH3 2.5 mm Feeder 80004802
Technical Library | 2024-06-23 21:57:16.0
Two extremes of reflow time scale for copper pillar flip chip solder joints were explored in this study. Sn-2.5Ag solder capped pillars were joined to laminate substrates using either conventional forced convection reflow or the controlled impingement of a defocused infrared laser. The laser reflow joining process was accomplished with an order of magnitude reduction in time above liquidus and a similar increase in solidification cooling rate. The brief reflow time and rapid cooling of a laser impingement reflow necessarily affects all time and temperature dependent phenomena characteristic of reflowed molten solder. These include second phase precipitate dissolution, base metal (copper) dissolution, and the extent of surface wetting. This study examines the reflow dependent microstructural aspects of flip chip Sn-Ag joints on samples of two different size scales, the first with copper pillars of 70μm diameter on 120μm pitch and the second with 23μm diameter pillars on a 40μm pitch. The length scale of Pb-free solder joints is known to affect the Sn grain solidification structure; Sn grain morphology will be noted across both reflow time and joint length scales. Sn grain morphology was further found to be dependent on the extent of surface wetting when such wetting circumvented the copper diffusion barrier layer. Microstructural analysis also will include a comparison of intermetallic structures formed; including the size and number density of second phase Ag3Sn precipitates in the joint and the morphology and thickness of the interfacial intermetallics formed on the pillar and substrate surfaces.
These are the instructions for the BEST Heatshields(TM) an effective, high tech simple way to shield heat sensitive components during reflow/rework. This ceramic-based non-woven material, when properly deployed, will protect components so that they d
Just released a new Digital Multimeter with a record number of features: • L-C-R-ESR-LED/Diode Test, 0.1% Basic Accuracy • Measurements of Frequency, Period, Duty Cycle to 400 kHz • Oscilloscope 100 kHz, AC/DC Voltage up to 15 V • Signal Generator: S
Career Center | Theni, Tamilnadu India | Engineering
NPI Engineer: • Playing a role as NPI leader of the Telecom, Aerospace & Server Products to introduce and run to qualify the engineering build from customer. • Conducting Weekly NPI meeting with the CFT team to review the progress of the NPI schedu
SMTnet Express, June 24, 2021, Subscribers: 26,990, Companies: 11,385, Users: 26,722 Filling of Microvias and Through Holes by Electrolytic Copper Plating — Current Status and Future Outlook The electronics industry is further
| http://www.feedersupplier.com/sale-26472363-spherical-cap-12x16mm-feeder-spare-parts-00322501s01-siemens-asm-siplace.html
Spherical Cap 12x16mm Feeder Spare Parts 00322501s01 Siemens ASM Siplace Leave a Message We will call you back soon! Your message must be between 20-3,000 characters
KD Electronics Ltd. | http://www.kundasmt.com/a/PRODUCTS/2829.html
EQUIPMENT Equipment Accessories REFLOW FURNACE MPM DEK Rehm HELLER OTHER PARTS CONTACT US SURFACE MOUNT SYSTEM Product number:03011249-01 Description
