Electronics Forum | Tue Aug 31 15:43:41 EDT 2004 | davef
You�re asking the wrong person to give remedial math lessons. Anyhow, here we go: * [1.56 microgram NaCl/cm^2]*[2.54 cm/in]*[2.54 cm/in] = 10.06 microgram NaCl/in^2 * [Omegameter] / [MIL-P-28809 Beckman / Markson] = [10.06 microgram NaCl/in^2] / [GS
Electronics Forum | Sat Sep 25 03:44:38 EDT 2004 | GS
Thanks Davef, unfotunately in order to keep TIC of PBA inside our customer TIC requirements, we have to pre-wash (DI water only)connectors before assembly. Too high level of Br- continuosly get released by connectors molding compound. Our assemb
Electronics Forum | Thu Jan 18 15:28:10 EST 2007 | CK the Flip
If you are, in fact, running a No-Clean solder paste: Different no-clean solder pastes will leave different types of (benign) residues. If your paste has been qualified from a Bellcore/SIR/Electromigration standpoint, any residues remaining will NO
Electronics Forum | Tue Feb 08 04:27:55 EST 2011 | thomas111
hi, I am a Hardware designer . One of my products is undergoing a Reliability test in which a resistor shows a high value on board from its specified value .However it retains the original value when its cooled under room temperature. The resistor
Electronics Forum | Fri Jun 07 11:19:14 EDT 2019 | gregoryyork
If you have soldered with HASL finish then the worrying chemistry will be more like NON IONIC. They sit there and attract moisture like mad and any chlorides they hold ionize in the moisture attracted and cause electromigration or SIR issues. They ca
Electronics Forum | Fri Aug 16 12:32:56 EDT 2019 | edhare
Steve, Yes, in my experience clients send in field failures (so latent failures) that exhibit internal shorts when a secondary fracture propagates from a knit line fracture. These eventually short due to electro-migration from plate-to-plate through
Electronics Forum | Mon Jun 28 10:03:22 EDT 2004 | davef
First, welcome to your new job. Second, IPC-TM-650 2.6.14 is only loosely an �Ionic Contamination (Electromigration) Test�. * Electromigration Test, IPC TM 650 2.6.14, 2.6.14.1 * Ion Chromatography for Ionic Cleanliness, IPC TM 650 2.3.28 Third, I
Electronics Forum | Fri Oct 06 15:12:17 EDT 2000 | Dave F
Alberto: Consider Dymax 911. It�s wave solderable and passes Cl ion, copper mirror, SIR, and electromigration tests. We have heard good things about Masterbond uV curables, but have not looked at them. 911 doesn�t cure very deep into the little d
Electronics Forum | Wed Nov 03 21:17:40 EST 1999 | Doug B.
Yes this is absolutely true. No-clean flux residue has various affects on the functionality of circuitry especially high impedance circuits. It also affects solderability, and reliability. No-clean flux will always leave a detectable residue. Mos
Electronics Forum | Fri Jul 23 05:14:40 EDT 2004 | greg york
Hi Thomas Ever considered that this maybe HASL flux left on PCB as this is extremely hygroscopic and has heat transfer fluids that cannot be baked out unless you go to a temperature of around 600C. One way of testing is to leave iron tip on joint an
