Electronics Forum | Wed Dec 08 17:11:24 EST 2004 | SEvers
I am very familliar with various lasers and cutting technologies. This is probably the only laser technology that has a chance to do what you are after on FR-4 G10, G11 etc and not burn. It's new ground for them and I'll bet the system is not tooled
Electronics Forum | Mon Apr 01 20:10:24 EST 2002 | davef
Oh. [Howabout if I smack you?] If ahma connectin� wif whut yer sayin�, you: * Don�t like the appearance of the glue slobberin� out from under the component even though there is no apparent glue on solderable surfaces. * Concerned about the hydrosco
Electronics Forum | Tue Mar 27 04:39:27 EDT 2012 | andrzej
Have you got some experience with using laser (CO2 or fiber one) to label with barcode your PCBs ? So far I thought it is easy process but now we do tests with many PCBs covered with diffrent soldermasks and fiber laser as well as CO2 has same probl
Electronics Forum | Wed Jan 26 21:16:28 EST 2000 | Dave F
Mark: It sound like one or more of the following is happening: * Previous heat cycles (ie, reflow, reflow, wave) are degrading the surface protectant * Wire solder flux doesn't have enough stomp to burn through the corrosion. That poor ol' stuff
Electronics Forum | Thu Sep 06 10:04:54 EDT 2001 | blnorman
We have started switching all our PCB marking from labels to Laser marking. We have a silkscreen patch put on the boards then use a CO2 laser to burn the mark off to produce the barcode. Our marking downtime has gone from an average of 8 hours a we
Electronics Forum | Wed Dec 14 08:58:27 EST 2005 | russ
We experienced brittle solder joints that did not withstand thermal cycling as I was told. I am positive about the fractured joints but was informed by customer that it was thermal cycling of the part when they failed so they were latent failures.
Electronics Forum | Thu Mar 01 00:27:58 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Thu Mar 01 00:29:08 EST 2007 | Muhammad Haris
Hi, I believe ,do the BGA side first and then use glue from dispensor for the connector side. THIS CONDITION CAN BE FOLLOWED IF & ONLY IF UR CONNECTORS DO NOT BURN OR LOOSE THEIR PHYSICAL STATES. OR SIMPLY REDESIGN THE
Electronics Forum | Mon Mar 02 15:38:08 EST 2009 | kpm135
I would take the board in question and run it through again with your profiler to verify that no one has messed with your oven recipe, or your oven isn't malfunctioning. Also, a before and after pic attached to the post would probably be helpful to a
Electronics Forum | Thu Mar 05 09:46:12 EST 2009 | davef
Solder mask requirements: * IPC-6012 and IPC-SM-840 contain detailed specifications and information regarding solder mask requirements. * IPC-A-600 defines acceptability of printed boards [analog of A-610 for board assemblies]. Why can't you use A-6
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