Technical Library | 2019-07-10 23:36:14.0
Pockets of gas, or voids, trapped in the solder interface between discrete power management devices and circuit assemblies are, unfortunately, excellent insulators, or barriers to thermal conductivity. This resistance to heat flow reduces the electrical efficiency of these devices, reducing battery life and expected functional life time of electronic assemblies. There is also a corresponding increase in current density (as the area for current conduction is reduced) that generates additional heat, further leading to performance degradation.
Industry News | 2014-04-11 12:49:57.0
Heller Industries was announced the winner of the Circuits Assembly 2014 Service Excellence Award in the category of Reflow Soldering Companies.
Industry News | 2007-11-01 20:00:20.0
October 31, 2007, Florham Park, New Jersey � In continuation with its overall growth strategy, Heller Industries is pleased to announce the appointment of Mr. Wojtek Antoniak as Regional Sales Manager, Southeast Asia. Mr. Antoniak will be based in Singapore and will be responsible for sales management throughout Malaysia, Thailand, Vietnam as well as Singapore and the Philippines.
Career Center | Florham Park, New Jersey USA | Engineering
Field Service Engineer Job Description The basic function of this position: Installation, training, repair, and implementation of retrofits on the complete line of Heller reflow ovens. Candidate must be a US citizen. DUTIES AND RESPONSIBILITIES: S
Technical Library | 2024-08-20 00:40:08.0
In electronics manufacturing, 'Underfill' refers to a material that is applied to fill the gap between a semiconductor device, such as flip-chip assemblies, Ball Grid Arrays (BGA), or Chip Scale Packages (CSP), and the substrate, such as a PCB or flex circuit.
Technical Library | 2023-09-07 14:54:10.0
A global manufacturer of a broad line of electronic interconnect solutions worked with us to dispense conductive adhesive EpoTek H20E-FC. EpoTek H20E-FC is a two-component, electrically conductive, snap curing epoxy for photovoltaic thin film module stringing, semiconductor packaging and PCB circuit assembly. The primary goal was filling a rectangular cavity on a connector. The epoxy needed to fill the connector to the top of the walls in less than three seconds.
Industry News | 2013-06-07 15:36:04.0
GPD Global has signed a partnership agreement with Aegis Software to distribute CircuitCAM Express data translation software.
Industry News | 2011-04-04 15:41:07.0
GPD Global announces that it has appointed Horizon Sales as its representatives for the Midwestern states of Michigan, Ohio, Kentucky and Western Pennsylvania.
Industry News | 2012-03-05 14:26:45.0
GPD Global has been awarded a 2012 NPI Award in the category of Dispensing Equipment for its PCD Dispensing on the MAX Series Platform.
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
winsouce.jpg)