Industry News | 2009-03-27 22:41:41.0
MINNEAPOLIS, MN � The SMTA is soliciting applications from graduate-level student members of the SMTA pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the Charles Hutchins Educational Grant.
Industry News | 2011-02-19 18:41:00.0
The SMTA is soliciting applications from full time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the Charles Hutchins Educational Grant.
Industry News | 2012-02-10 16:01:52.0
The SMTA is soliciting applications from full time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the $5000 Charles Hutchins Educational Grant.
Industry News | 2013-02-09 08:35:11.0
The SMTA is soliciting applications from full time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the $5000 Charles Hutchins Educational Grant. Co-sponsored by the SMTA and CIRCUITS ASSEMBLY magazine, the Hutchins Grant was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins.
Industry News | 2014-01-29 12:37:30.0
The SMTA is soliciting applications from full time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the $5000 Charles Hutchins Educational Grant.
Industry News | 2015-02-22 18:23:29.0
The SMTA is soliciting applications from full time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the $5000 Charles Hutchins Educational Grant. Co-sponsored by the SMTA and CIRCUITS ASSEMBLY magazine, the Hutchins Grant was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins. The SMTA has awarded $85,000 to Hutchins Grant recipients since 1998!
Industry News | 2016-03-01 13:17:27.0
The SMTA is soliciting applications from full time graduate-level students pursuing a degree and working on thesis research in electronic assembly, electronics packaging, or a related field, for the $5000 Charles Hutchins Educational Grant. Co-sponsored by the SMTA and CIRCUITS ASSEMBLY magazine, the Hutchins Grant was established in memory of past SMTA president, educator, mentor, and industry colleague, Dr. Charles Hutchins. The SMTA has awarded $85,000 to Hutchins Grant recipients since 1998!
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
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Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
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Huizhou, 30 China
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