Industry News | 2009-08-07 19:24:15.0
Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.
Industry News | 2011-11-11 14:38:51.0
Want to get a handle on commonly used electronics industry acronyms and terminology? Look no further than the definitive resource, IPC-T-50J, Terms and Definitions for Interconnecting and Packaging Electronic Circuits. Recently released by IPC, the J revision of IPC-T-50 contains nearly 400 new or revised terms, including terminology for chip scale and area array packaging, cable and wire harness technology, semiconductor packaging, assembly processing, moisture sensitive components and microvia technology.
Industry News | 2010-10-16 19:00:32.0
IPC — Association Connecting Electronics Industries® invites researchers, technical experts and industry leaders to submit abstracts for poster presentations at IPC APEX EXPO™, the industry’s premier conference and exhibition for printed board design and manufacturing, electronics assembly and test, April 12–14, 2011, at the Mandalay Bay Resort & Convention Center, Las Vegas.
SMTA International Electronics Exhibition Tuesday, September 29: 9am-5pm Wednesday, September 30: 9am-4pm Donald Stephens Convention Center Rosemont, IL See More Equipment & Technology Than Ever Before! Many of the 160 exhibiting companies will bri
Industry News | 2022-10-20 06:56:33.0
SMTA is honored to announce Rajesh Sharma Sivasubramony, a graduate student at Binghamton University, has been selected as the winner of the 2022 Charles Hutchins Educational Grant.
Industry News | 2014-11-25 17:04:36.0
During the 2014 Annual Meeting at SMTA International, the SMTA announced that Christine Taylor, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2014 Charles Hutchins Educational Grant. The SMTA Grant Committee selected her project entitled "Nano- and Micro-scale Strain Sensors for Measuring Stress Evolution in Microelectronic Packages."
Industry News | 2015-12-05 16:08:55.0
During the 2015 Annual Meeting at SMTA International, the SMTA announced that Hanju Oh, a graduate student at Georgia Institute of Technology, has been selected as the recipient of the 2015 Charles Hutchins Educational Grant. The SMTA Grant Committee selected his project entitled "A Three-Dimensional Packaging Platform with Integrated Microfluidic Cooling."
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
Events Calendar | Tue Jun 02 00:00:00 EDT 2020 - Thu Jun 04 00:00:00 EDT 2020 | Markham, Ontario Canada
International Conference for Electronics Hardware Enabling Technologies (ICEHET)
Industry News | 2013-03-19 15:13:22.0
Dr. Choon Lee, senior vice president, Amkor Technology, and a leading expert and innovator in the field of packaging technology, will reveal their strengths and weaknesses during his keynote, “System Integration Challenges in Packaging,” at IPC Electronic System Technologies Conference & Exhibition (ESTC), on May 22, 2013.
Manufacturer of PCB depaneling and PCB soldering machines since 2005, products include CE approval V-groove PCB depanelizer, PCB router, PCB punching machine, laser depaneling, hot bar soldering machines and soldering robots.
Liwu Industrial Park, Yuanzhou Town, Boluo
Huizhou, 30 China
Phone: +86-138-29839112
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