Full Site - : electroplating (Page 10 of 22)

Cleaning Electroplated Solder

Electronics Forum | Fri Aug 20 10:18:32 EDT 1999 | Dennis Fall

I have a layer of electroplated solder (10/90) that appeares to have some sort of contaminent on it. Water will not wet to the layer in some areas. I have tried using 10% HCl in DI as a cleaner as well as 7.5% Fluoboric acid in DI. Neither has tou

Plating for aluminum wire bonding

Electronics Forum | Sun Mar 02 12:16:29 EST 2003 | ramanandkini

Recently, one of our new vendor supplied us PCBs with Electroplated Nickel and Gold. We have the other regular source giving us ENIG plating. In both the wirebonding quality is OK. How do we benchmark this? Which one is suitable for production with l

Plating for aluminum wire bonding

Electronics Forum | Mon Mar 03 10:38:28 EST 2003 | davef

Electroplated nickel and electroplated gold is the more �traditional� finish for aluminum wire bonding. That surface was an extension of gold thermosonic wire bonding that requires a thick [50 thou min] gold surface. For years fabricators recommend

ENIG vs Electroplating

Electronics Forum | Mon May 11 18:30:10 EDT 2009 | boardhouse

Hi Milas, Here is a link to an artical on the subject. http://pcdandf.com/cms/content/view/4784/95/ The big difference in the to is that ENIG is self limiting where as electroplating is not. All product manufactured with either finish goes throug

Electroplating 3D Printed Plastic Parts

Electronics Forum | Sat Nov 09 19:18:24 EST 2019 | richardcargill

I'd have thought that the surface finish would be pretty much the same as when printed as electroplating is monumentally thin. I've not tried plastics, but when plating metals the surface has to be pretty much perfect in order to get an attractive re

Shielding

Electronics Forum | Thu Mar 04 14:33:09 EST 1999 | Greg Valdman

Our vendor proposed to supply us with shields made out of Cold Rolled Steel (CRS) electroplated with Sn (50 - 150 minches). Should I be concerned with solderability or are there a better alternatives to tin finish?

Voids in solder bumps

Electronics Forum | Mon Sep 28 12:55:37 EDT 1998 | Manish Ranjan

Hi Everyone Does anyone has any insight regarding the void formation in the solderbumps during wafer bumping by electroplating. Someone told me that it could be mainly coz of the alloy concentration being incorrect. Any suggestions, corrective action

AuSn Alloy Solder Electroplating

Electronics Forum | Wed Sep 29 14:46:59 EDT 2004 | Bryan Smith, Micralyne

I am curious to hear feedback on whether companies that could benefit from a AuSn solder plating process would prefer to bring it inhouse (ie. License) or outsource the plating. I look forward to your comments. Bryan Smith Micralyne www.goldtinsold

AuSn Alloy Solder Electroplating

Electronics Forum | Wed Sep 29 17:59:59 EDT 2004 | gregoryyork

I would be interested in this as well. Can you forward me some details. thanks Greg York Technical Sales Manager BLT Circuit Services Ltd - UK

AuSn Alloy Solder Electroplating

Electronics Forum | Fri Oct 01 18:12:02 EDT 2004 | Bryan Smith

Hi Greg, You can find details on our AuSn solder plating at http://www.goldtinsolder.com. Call me at 780-431-4412 if you have questions. Take care, Bryan


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