Industry Directory: eliminate lga (2)

Taiwan Dry Tech Corp.

Industry Directory | Consultant / Service Provider / Manufacturer / Other

Taiwan Dry Tech Corp. manufacturer of Eureka Dry Tech Fast Super Dryers for moisture/humidity proof protective storage of PCB, MSD, IC packages, meets IPC/JEDEC J-STD-033 & IPC-1601.

SMT Dry Cabinets by Eureka Dry Tech

Industry Directory | Consultant / Service Provider / Manufacturer

Eureka Dry Tech's IPC/JEDEC J-Std-033c Ultra Low Humidity Dry Cabinets provides moisture/humidity controlled storage of MSD,PCB, IC packages. Drying technology trusted by millions in replacing baking, nitrogen & desiccant packs.

New SMT Equipment: eliminate lga (4)

StencilMate™ Leadless Device Rework Stencils

StencilMate™ Leadless Device Rework Stencils

New Equipment | Solder Paste Stencils

Simplify and Speed Up QFN and LGA device rework. StencilMate™ leadless device rework stencils make the process of reworking leadless devices such as QFNs and LGAs simple and fast. These adhesive-backed poyimide stencils are placed on to the bottom o

BEST Inc.

H10 Halogen-Free No Clean Solder Paste

H10 Halogen-Free No Clean Solder Paste

New Equipment | Solder Materials

90% on area ratios of 0.50 and a stencil life >8 hours. H10’s powerful wetting characteristics eliminate NWO (HiP) defects and improve pad coverage on all surface finishes. H10 reduces voiding on BGA, BTC and LGA and offers enhanced electrochemical r

AIM Solder

Electronics Forum: eliminate lga (8)

LGA and Solderballs

Electronics Forum | Tue Nov 28 17:43:03 EST 2006 | IRAS

I'm looking to gain some knowledge on potential causes of solderballs on LGA's and advice on how to eliminate them. we all seeing some solderballs on only the edges of the LGA. Any inputs will be greatful.

Voiding in LGA (LT) soldering

Electronics Forum | Thu Sep 09 05:23:10 EDT 2010 | 15009

You can reduce and almost eliminate voids and other paste related defects in LGA's BGA's, QFN's etc, by using solid solder deposit. Its been around for 24 years, 13 in the US. It is now included in the new IPC 7093 specification for bottom terminat

Industry News: eliminate lga (9)

Soldering, Coating, Cleaning and PCB Process Failures from the Desk of Bob Willis

Industry News | 2018-03-25 13:21:16.0

The widest selection of online webinars in the industry has added more titles

ASKbobwillis.com

Virtual Industries to Showcase Leading Vacuum Handling Solutions at SPIE Photonics West 2011

Industry News | 2011-01-05 16:07:01.0

Virtual Industries Inc. announces that it will display several advanced systems in Booth 2141 at the upcoming SPIE Photonics West exhibition, scheduled to take place January 22-27, 2011 at the Moscone Center in San Francisco.

Virtual Industries, Inc.

Technical Library: eliminate lga (1)

Solder Joint Encapsulant Adhesive - LGA High Reliability And Low Cost Assembly Solution

Technical Library | 2016-01-12 11:01:25.0

More and more Land Grid Array (LGA) components are being used in electronic devices such as smartphones, tablets and computers. In order to enhance LGA mechanical strength and reliability, capillary flow underfill is used to improve reliability. However, due to the small gap, it is difficult for capillary underfill to flow into the LGA at SMT level. Due to cost considerations, there are usually no pre-heating underfill or cleaning flux residue processes at the SMT assembly line. YINCAE solder joint encapsulant SMT256 has been successfully used with solder paste for LGA assembly. Solder joint encapsulant is used in in-line LGA soldering process with enhanced reliability. It eliminates the underfilling process and provides excellent reworkability. The shear st rength of solder joint is stronger than that of underfilled components. The thermal cycling performance using solder joint encapsulant is much better than that using underfill. Bottom IC of POP has been studied for further understanding of LGA assembly process parameters. All details such as assembly process, drop test and thermal cycling test will be discussed in this paper.

YINCAE Advanced Materials, LLC.

Videos: eliminate lga (2)

QFN Rework Using Polyimide Stencil

QFN Rework Using Polyimide Stencil

Videos

Video demonstrates easy to use leadless device rework process using polyimide stencil. This is the process described in IPC 7711/21 Procedure 5.8.1.1. and 5.8.1.2. For More Information Visit Our Site: http://www.solder.net/services/qfn-rework For

BEST Inc.

Adhesion Testing - How to Do it!

Adhesion Testing - How to Do it!

Videos

Bob Willis videos show you How to Do It each month. This month we talk about adhesion testing like copper foil, plated copper on PCBs or conformal coating adhesion to board assemblies. Adhesion testing can be used for many different materials and in

ASKbobwillis.com

Career Center - Resumes: eliminate lga (1)

Debug engineer or bga rework engineer

Career Center | banaglore, karnataka India | Maintenance,Production,Quality Control,Technical Support

tel u later

Express Newsletter: eliminate lga (138)

Partner Websites: eliminate lga (2)

Recent searches - Heller

Heller Industries Inc. | https://hellerindustries.com/recent-searches/

Troubleshooting 581348 Horizontal 180 9 mkitt Heller autoclean Lga Dong young analyzer 1809 mk iv High temperature oil Water filter Revenu Fast cooling Electrical manual Safety Fans Heller 1913 mark111 ir 1913 mark 3 ir Batch 845 50cm pedestal fan Slip clutch

Heller Industries Inc.


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