Used SMT Equipment | SMT Equipment
Product Name: Panasoinc chip mounter CM20F Product number: CM20F Detailed product introduction CM20F Panasonic multi function placement machine Chip speed 0.58s/chip, 1.1s/QFP Substrate size (mm) 50mm X:L W 50mm to L 330mm X W 250mm Time of i
Used SMT Equipment | SMT Equipment
Product Name: Panasoinc chip mounter CM88S-3 Product number: CM88S-3 Detailed product introduction High speed chip CM88C-M Panasonic Machine model: CM88C/S Machine year: 1999-2002 PCB size: Min:50*50 Max:330*250 Patch speed: 0.085 seconds /CH
Used SMT Equipment | SMT Equipment
Product Name: Panasoinc chip mounter CM202-D Product number: CM202-D Detailed product introduction High speed chip CM202-DH /DS Panasonic Theoretical speed: 0.1SEC/SOP, IC 0.088SEC/CHIP Material station: 160 station (40*4) Working head: 4, one
Used SMT Equipment | SMT Equipment
Product Name: Panasoinc chip mounter CM301-D Product number: CM301-D Detailed product introduction High speed chip CM301 Panasonic Chip speed 0.25s/chip, 0.6s/QFP Substrate size (mm) 50mm X:L W 50mm to L 330mm X W 460mm Time of import and expo
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
V100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Y100X middle speed Chip mounter Placement Speed: Chips :18000cph(0.2sec/chip) QFPs:2100CPH(1.7sec /QFP) Placement Range:0.6X0.3mm~ QFP to□32mm Placement Station:
Used SMT Equipment | Semiconductor & Solar
Product number: YV100X Products in detail YAMAHA multi-function placement machineYAMAHA YV100X substrate size: ATS20 (end to put) W -AT assembly: L460 * W250 (Max)/L50 * W50 (Min)substrate thickness: 0.4 to 3.0 substratetransfer direction
Used SMT Equipment | Semiconductor & Solar
Model YV100II SMT speed :0.25 SEC /CHIP high speed mount Substrate size: L600*W400(Max)/L50*W50(Min) Substrate thickness 0.4-3.0 Mounting accuracy ± 0.1mm/CHIP ±0.08/QFP Power three-phase AC220/208/230/240/380/400/416 v + / - 10%,
Used SMT Equipment | Flexible Mounters
Product Name: FX-3 JUKI chip mounter Product number: FX-3 Detailed product introduction FX-3 JUKI parameters The best conditions: 0.040 seconds / chip (90000CPH) * The laser head*4 (24 nozzle) 0402 chip ~33.5mm square elements (or diagonal Lon
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