Industry Directory | Consultant / Service Provider
Supermax ECAD - Advanced EDA solutions for PCB, MCM & Hybrid design. Supports all types of designs including RF, Microwave, High-Speed and Advanced Packaging.
Industry Directory | Consultant / Service Provider / Manufacturer
Designer, manufacturer and assembler of quickturn protoype to high volume production of flex circuits, rigid-flex and HDI flex circuits
New Equipment | Rework & Repair Equipment
BGA Rework Stations from the BGA Experts with over 25 years rework process experience and customer support! For high volume BGA Rework on even the largest computer and networking boards! The model SV560A has a high resolution optical system for pla
New Equipment | Education/Training
IPC-7351B includes both the standard and an IPC-7351B land pattern calculator on CD-ROM for accessing component and land pattern dimensional data.The calculator includes the document’s mathematical algorithms so users can build a land pattern for a c
Electronics Forum | Mon Feb 03 18:37:28 EST 2003 | jonfox
Not to be off-topic, but push engineering for embedded passives and remove parts from the underside all together. Watch the material cost sky rocket, but watch the manufacturing cost sink and well as improve the production cycle by 50%. Sorry, I w
Electronics Forum | Fri Jun 20 01:12:50 EDT 2008 | chrispy1963
Look into a used Siemens F-4 or F-5. These machines can be had for a reasonable cost, they are easy to maintain, the footprint is small (7' X 7.5') and they are simple to program. These machines have a 12 nozzle "Star" revolving placement head for
Used SMT Equipment | General Purpose Test & Measurement
We ship worldwide. Please feel free to contact us if you need further information. EXFO FTB-500 Platform and FLS-5834A CD/PMD Analyzer Source Connects anywhere: USB, 3G, Wi-Fi, VPN and Bluetooth Loaded with utilities: all the tools required to
Used SMT Equipment | General Purpose Test & Measurement
Highly expandable, plug-in, modular design bit error rate tester (BERT) Bit Error Rate test from 0.1 Gbit/s to 32.1 Gbit/s; 64.2 Gbit/s with external MUX/DeMUX Supports signal integrity analysis for a variety of 100G+ applications High speed ba
Industry News | 2003-03-24 09:46:41.0
Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.
Industry News | 2003-04-07 10:16:38.0
Portable Products and Optoelectronic Applications Still Hold Promise for Growth
Technical Library | 2016-06-16 15:29:31.0
Embedding components within the PC board structure is not a new concept. Until recently, however, most embedded component PC board applications adapted only passive elements. The early component forming processes relied on resistive inks and films to enable embedding of resistor and capacitors elements. Although these forming methods remain viable, many companies are choosing to place very thin discrete passive components and semiconductor die elements within the PC board layering structure. In addition to improving the products performance, companies have found that by reducing the component population on the PC board's surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the closer coupling of key elements can also contribute to improving functional performance.This paper focuses on six basic embedded component structure designs described in IPC-7092.
Technical Library | 2011-10-06 13:59:04.0
The desire to have more functionality into increasingly smaller size end products has been pushing the PCB and IC Packaging industry towards High Density Interconnect (HDI) and 3D Packaging (stacked dies, embedded packaged components). Many companies in the high-end consumer electronics market place have been embedding passive chip components on inner PCB and IC Packages for a few years now. However, embedding packaged components on inner layers has remained elusive for the broader market due to lack of proper design tools and high cost of embedding components on inner layers (...) This paper will highlight several key industrialization aspects addressed in the frame of the European funded FP7 HERMES* project to build a manufacturing environment for products with embedded components. The program entered its third year and is now dealing with the manufacturing of functional demonstrators as an introduction to industrialization.
www.unisoft-cim.com/cells.html - CELLS WORKFLOW is affordable, simple to setup & use yet powerful product & job tracking software for fast New Product Introduction (NPI). The CELLS WORKFLOW software provides total traceability in manufacturing floor
Training Courses | ON DEMAND | | IPC-6012 Trainer (CIT)
The Certified IPC-6012 Trainer (CIT) courses recognize individuals as qualified trainers in the area of design, fabrication and inspection of rigid printed boards and prepare them to deliver Certified IPC-6012 Specialist (CIS) training.
Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China
SMTA China East Conference 2018
Events Calendar | Tue Jul 17 00:00:00 EDT 2018 - Wed Jul 18 00:00:00 EDT 2018 | ,
Fan Out Packaging- Technology Overview and Evolution - SMTA Webtorial
Career Center | Tampa, Florida | Engineering,Production,Research and Development
Reptron Engineering Services, a division of Reptron Electronics, is growing and needs your design engineering experience. Your main duties will be providing design services to Reptron�s customers for product development and new product introduction i
Career Center | Tampa, Florida USA | Engineering
Reptron Engineering Services, a division of Reptron Electronics, is growing and needs your design engineering experience. Your main duties will be providing design services to Reptron�s customers for product development and new product introduction i
Career Center | BANGALORE, India | Engineering,Maintenance,Production
Hi, I have 8 years experience in electronics manufacturing company. I have good knowledge in SMT process and equipment maintenance.i successfully completed more than 200 NPI's. I have good knowledge in SMT machine programming and maintenance
SMTnet Express, January 9, 2014, Subscribers: 26467, Members: Companies: 13548, Users: 35610 Embedded Passive Technology by Hikmat Chammas; Honeywell International Embedded Passive Technology is a viable technology that has been reliably used
SMTnet Express, June 16, 2016, Subscribers: 25,128, Companies: 14,822, Users: 40,485 Embedding Passive and Active Components: PCB Design and Fabrication Process Variations Vern Solberg; Vern Solberg - Solberg Technical Consulting Embedding
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/701937-passive-probe-600v-227832?page=15&order=list_price+asc
> MOREL Passive probe 600V 701937 QYSMT, SMT ESD MAGAZINE, ESD MAGAZINE, smt nozzle, smd parts, feeder smd, pick and place nozzle, smt feeder, nozzle supplier, smd nozzle, feeder smt, nozzle smt
GPD Global | https://www.gpd-global.com/co_website/pdf/doc/Embedded-IR-Heater-User-Guide-22140091.pdf
Embedded IR Heater User Guide Embedded Infrared Heater User Guide Version 1.0 July 1, 2020 Part No. 22140091 for use with: Control Software (PN 2050-0104) and Embedded Infrared Heater User Guide
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