Industry News | 2013-08-07 10:33:35.0
2) to maximize yields and product quality. In fact, the Momentum Compact delivers the highest throughput for its footprint in the industry.
Used SMT Equipment | Conveyors
CTI Systems Turntable Conveyor Model: TTA-30I-3S-3134 Vintage: 2013 Motorized Cam Drive for Rotation Edges of Conveyor are flush with Edges of Adjacent Machines Select Flow Directional via Control Panel Totally Enclosed for Safety with Interloc
Industry News | 2008-03-20 21:02:07.0
Since it�s introduction to the electronics industry over ten years ago, DEK�s ProFlow� enclosed head printing system has won numerous awards and effectively enabled many advances in materials deposition applications around the globe. Now, as ProFlow moves into its second decade, the technology has been further developed to deliver an expanded process window and even broader capabilities.
Industry News | 2006-04-17 18:17:31.0
DEK has won another prestigious industry award for its revolutionary ProFlow� DirEKt Imaging technology. At the Nepcon China 2006 exhibition in Shanghai, China, DEK will receive the award for best entry in the Dispensing Systems/Equipment category at the Electronics Manufacturing Asia Innovation Awards 2006.
Industry News | 2013-09-23 17:01:03.0
In a bid to 'steal the show' at Productronica this year, Speedline will be introducing breakthrough innovations in production technology, two of them Camalot® dispensing innovations. These are the new Prodigy™ dispensing system, a new platform that’s more compact and powerful than its predecessors, and the revolutionary new NanoShot™ closed-loop dot-on-demand pump.
Industry News | 2010-04-28 21:43:42.0
Following a successful evaluation period, DEK’s ProFlow® ATx enclosed print head technology has been adopted by a high profile electronics company due to its ability to meet complex mass production requirements. As specialists in design, production and product management, the electronics solutions company had strict evaluation criteria that the DEK system successfully met and even, in some cases, exceeded.
Industry News | 2003-03-11 09:04:04.0
Developed in response to customer requirements, the new Via Fill process from DEK delivers 100% fill of substrate vias with no voids and minimal surface residue.
Industry News | 2010-04-22 16:26:45.0
DEK's ProFlow® system is arguably the gold-standard for enclosed head printing technology. With nearly a decade of documented process advance under its belt, ProFlow has now evolved to deliver even greater electronics assembly performance, ease-of-use and environmental responsibility with ProFlow ATx.
Industry News | 2010-03-17 18:13:49.0
From the recently enhanced Horizon platform to complete print process control tools to next-generation stencil technologies, the DEK display at APEX 2010 will treat booth visitors to the ultimate in print productivity.
Industry News | 2003-06-13 10:10:58.0
By combining PacTech's electroless under bump metallization (UBM) processing with DEK's advanced mass imaging systems to create the solder bumps, users can implement a wafer-level, SMT-compatible flip chip assembly process.
