New SMT Equipment: enepig aluminum (1)

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier

New Equipment | Fabrication Services

Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications

Agile Circuit Co., Ltd

Electronics Forum: enepig aluminum (3)

Aluminum wire bonding on ENEPIG plated PCB

Electronics Forum | Mon Sep 09 15:38:02 EDT 2013 | arendonk

Hi, We are having issues aluminum wirebonding on ENEPIG plated PCB by a too low pull force and or having lifts (1% range). Could any body advice how to solve this problem? Is there a special wire bond grade required? How to best clean contaminant

Aluminum wire bonding on ENEPIG plated PCB

Electronics Forum | Tue Sep 10 10:42:36 EDT 2013 | capse

Plasma cleaning is used extensively to clean surfaces prior to wire bonding.

Industry News: enepig aluminum (1)

Guideline for wire bonding

Industry News | 2019-11-05 22:19:03.0

> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.

Headpcb

Express Newsletter: enepig aluminum (33)

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers

Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers SMTnet Express October 11, 2012, Subscribers: 25550, Members: Companies: 9005, Users: 33789 Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish

Influence of Pd Thickness on Micro Void Formation of Solder Joints in ENEPIG Surface Finish SMTnet Express December 13, 2012, Subscribers: 26067, Members: Companies: 9068, Users: 34058 Influence of Pd Thickness on Micro Void Formation of Solder


enepig aluminum searches for Companies, Equipment, Machines, Suppliers & Information

Sm t t t t net
  1 2 3 4 Next
PCB Handling with CE

High Resolution Fast Speed Industrial Cameras.
Selective Soldering Nozzles

Nozzles, Feeders, Spare Parts - Siemens, Fuji, Juki, Yamaha, etc...
IPC Training & Certification - Blackfox

High Throughput Reflow Oven
PCB Handling Machine with CE

World's Best Reflow Oven Customizable for Unique Applications


"回流焊炉"