Industry Directory | Manufacturer
The company was founded in 2000. UL certification, prototype & mass production, urgent express delivery, excellent quality, competitive price, most of products exported to all over the world, and get highly appreciated.
Industry Directory | Manufacturer
JINSUNG ELECTRONICS CO. designs and manufactures the customized Printed Circuit Board(PCB) based in South Korea since 1995 throughout types of Single-sided, Double-sided, Multilayer, Flex, Rigid-Flex.
New Equipment | Fabrication Services
RF & Microwave PCB's ACI is a leader in providing complex RF/Microwave PCB’s covering a wide spectrum of product types including Defense/Aerospace, Medical Device, Imaging, and Telecommunications Equipment. ACI supports a wide range of frequency ban
New Equipment | Fabrication Services
Low Cost Heavy Copper PCB China 4 Layers Circuit Boards Supplier Quick Details: FR4 base material 1.6mm board thickness 2oz heavy copper Plating gold finishing RF custom PCB boards Used for Radio Frequency From China PCB manufacturer Specifications
Electronics Forum | Tue Feb 21 03:20:57 EST 2017 | pcbcart
We're a custom PCB manufacturing services provider based in China and we have made many high quality circuit boards for high end products. Based on your project requirements and our years' experience, we are positive that ENIG is totally sufficient.
Electronics Forum | Tue Jan 04 10:37:48 EST 2011 | johanhuizing
Hi Mike, We only are using ENIG not hard gold, we are using edge contacts but the connectors will only be removed if the product is being replaced, normal life time for the equipment where the electronics is build-in is 15 years. Also the electronic
Industry News | 2016-06-10 09:45:09.0
Cranston RI - Technic is pleased to announce the installation of the TechniPad Electroless Palladium process AT7015 at Gold Plating Services (GPS) in Santa Clara CA. GPS is a contract plating service specializing in precious metal plating for the printed circuit board industry.
Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
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Parts & Supplies | Pick and Place/Feeders
CYBEROPTICS laser/CYBEROPTICS camera:JUKI laser(570/620/730/740/750/760/2010/2020/2030/2040/2050/2060/2070/2080/KJ-01/KJ-02//FX-1/FX-2/FX-3/3020R/JX-100 laser unit),YAMAHA laser,SAMSUNG laser,TENRYU laser,PHILIPS(ASSEMBLEON) FCM PPU laser,Autotronik
Career Center | Temple Hills, Maryland USA | Maintenance,Management,Technical Support
• Installing Network Hardware • Trouble shooting – Hardware and software • System Administration • Procurement Management • Naval Facilities Management • Great Customer Service
Career Center | , | 2013-03-07 10:18:07.0
Currently work as Equipment Engineer at Integrated Microelectronics Inc., Philippines handles Line Maintenance Technicians, that performs production equipment setup and sustenance. Implements/creates improvements on assigned area. Maintains group KRA
Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure Pd-Layers SMTnet Express October 11, 2012, Subscribers: 25550, Members: Companies: 9005, Users: 33789 Wire Bonding and Soldering on Enepig and Enep Surface Finishes with Pure
SMTnet Express, September 7, 2017, Subscribers: 30,782, Members: Companies: 10,712, Users: 23,761 Challenges on ENEPIG Finished PCBs: Gold Ball Bonding and Pad Metal Lift Young K. Song and Vanja Bukva; Teledyne DALSA As a surface finish for PCBs
| https://www.eptac.com/blog/how-robert-downey-jr-s-footprint-coalition-and-ai-solutions-will-affect-oems
, it’s hard to imagine a problem that couldn’t be impacted greatly by AI solutions. With environmental protection and advocacy becoming a more important issue, increased use of this technology should be expected in both the natural and business environments
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/journal.cfm
) and Gold Embrittlement Conditions David Hillman and Daphne Gates Abstract 32-3 Assessment of 2nd Level Interconnect Quality in Flip Chip Ball Grid Array (FCBGA
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