Industry Directory | Manufacturer
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
Industry Directory | Manufacturer
Flason is high-tech enterprise focusing on SMT research and development,building new advanced solutions in SMT Assembly machines, like reflow oven, wave soldering machine, pick and place machine, AOI,SPI,PCB conveyor etc.
Features: 1) Saves components at start of tape reel 2) Available for 8 / 12 / 16 / 24 / 32 / 44mm SMD tapes 3) Reduce component lost; 500 / 250pcs box 4) Energy saving: reduces operation time and spare part of feeder
Electronics Forum | Thu Nov 30 21:23:44 EST 2000 | Dave F
Design more products and get wealthy. Don't waste your time and energy in areas that others are accomplished. A friend designs boards, sells $10M [what that is in euro, funny money, I don't know or care] of them a year, with a company of five [in
Electronics Forum | Mon Oct 02 21:36:03 EDT 2006 | davef
All of us wave solder FR4 all day-long, not to say we have never had problems doing it. The selection of the laminate material should depend on the burnin application. We'd be concerned about a FR4 burnin board that saw GT 150*C for extended period
Used SMT Equipment | Soldering - Reflow
Energy Tech Systems Curing/Reflow Oven. Model 4814. Very Good Condition. 208V, 3 Phase, 60 Amps. IR, Edge chain rail. 4 heating zones one cooling zone. 2 inch clearance for curing assemblies with tall components. PCB width adjustment and speed adju
Used SMT Equipment | Soldering - Reflow
TrioTek: Ultraviolet UV Curing, IR Thermal Curing, Moisture Curing for encapsulants, adhesives, conformal coatings and potting compounds TrioTek™ inline curing ovens from ETS are ideal for medium to high-volume curing or drying of encapsulants, con
Industry News | 2020-07-07 13:55:37.0
MIRTEC is pleased to announce that Gentec, a Québec-based design and manufacturing company specializing in rugged and reliable custom-made products and solutions in the fields of high-tech, power and power management electronics, has selected MIRTEC's award-winning MV-3 OMNI Desktop 3D AOI system. The MV-3 OMNI is the perfect 3D Inspection Solution to strengthen Gentec's commitment to uncompromised production quality.
Industry News | 2003-03-31 09:31:11.0
Electronic contract manufacturers face tough realities
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Parts & Supplies | Pick and Place/Feeders
ZK Electronic Technology Co.,Limited supply JUKI placement machine original parts, JUKI placement machine repair, JUKI Mounter feeder JUKI Mounter nozzles, JUKI Mounter Board Repair, JUKI Mounter Motor Repair, JUKI SMD Laser repair, JUKI placement m
Parts & Supplies | Assembly Accessories
NO. GREASE MODEL PACKAGING 1 Three Bond 2706 Oil & Grease Removing Agent 420ML/PC 10PC/Carton 2 BIRAL T&D spary lubricant 500ML/PC 12PC/Carton 3 BIRAL VG-HT spary lubricant 500ML/PC 12PC/Carton 4 BIRAL BIO-30 high temperature chain oil 1000G
Technical Library | 2019-05-24 09:27:33.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
Technical Library | 2019-05-29 10:38:59.0
Decapsulation, or de-cap, is a failure analysis technique which involves the removal of material packaging from an integrated circuit (IC). After de-cap, visual inspection by optical microscopy of the internal circuitry may reveal areas where damage is most likely to have occurred. In addition, scanning electron microscopy (SEM) with energy dispersive x-ray spectroscopy (EDS) can identify the composition of any anomalies present after de-cap under higher magnification. The removal process of package material can be done either mechanically or chemically depending on the design of the integrated circuit. With ceramic packaging, de-cap is usually done mechanically by chiseling off the top with a fine razor and small hammer. For plastic packaging, de-cap requires chemical etching by strong acids. In this Tech Tips article, de-cap by chemical etching will be outlined step by step.
slim kic 2000 Specifications: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
SLIM KIC 2000 SPECIFICATIONS: KIC 2000 Profiler * 9 Channels Slim Kit KIC 2000 Profiler * 9 Channels * Full Original Package, with original Thermal Couples, Protective Shield, Software, etc * Technical Support and Warranty from USA * Thermal Pr
Career Center | FREMONT, California USA | Sales/Marketing
Excellent opportunity for a highly motivated individual interested in a long term sales career in the Tech industry. Macrotron is seeking an Sales Associate to handle accounts for electronic manufacturing services. EMS services include assembly, SMT,
Career Center | Manhattan Beach, California USA | Sales/Marketing
Attention Sales people! Electronic Conventions Inc., ECI, a leader in the tradeshow industry for over 50 years and producer of North America's largest trade show for EOEM solutions in the world, is hiring for an inside exhibit-space Sales Representa
Career Center | , | 2013-01-24 13:12:30.0
Write now I am working as a Production Engineer of Mobile Charger and CFL.Assembling of componenens over PCB,Soldreing has to be done under my supervision.
Career Center | Palm Bay, Florida USA | Engineering,Production
1 year of SMT production experience in a low/med volume, high mix environment. IPC-A-610 Certified Specialist. Reflow profiling experience Heavy CAM programming experience with prototypes and new products
| https://pcbasupplies.com/stencil-wipe-12x12-150-ea/
Stencil Wipe 12"x12", 150 Each Login Create Account Contact View My Cart Menu × Categories Hand Soldering & Rework Automation Tooling PCB Support Systems Soldering Robots Material Handling Dry Storage Cabinets Component Handling Selective Solder Nozzles Pick
Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/at512s-nozzle-holder-qc-tech-at512s-200457?page=622&order=list_price+asc
IPULSE NOZZLE HOLDER QC TECH AT512S AT512S | QYSMT × Home About US ABOUT US FAQ SMT spare parts SMT Surplus equipments SMT peripheral equipments News Contact US 0 0 Sign in Contact Us Products NOZZLE HOLDER QC TECH AT512S Public Pricelist Public
A US manufacturer of quality hand tools for those engaged in the repair, rework, R & D, testing, and assembly of electronic components and printed circuit boards from Through Hole to 2Mil Pitch Surface Mount.
98 Elm St.
Portland, ME USA
Phone: 1-207-775-6139
