New Equipment | Design Services
Our design services – the total package. At i3, we are the premier supplier of leading-edge PCB and semiconductor package designs. We maintain a highly skilled team of design engineers with more than 170 years of collective experience in the desi
New Equipment | Fabrication Services
Material: FR-4 Board thickness: 2.4mm Copper thickness: 140um/4oz Surface finishing: Immersion Gold (ENIG) Solder mask: blue, green, yellow, white, red, black, purple Application: UPS, power supply, convertor, motor For your board, feel free t
Electronics Forum | Thu May 13 09:52:34 EDT 2021 | winston_one
Want to update this question a little, I know it appears few years ago, but I hope there is some updates... We have to assembly few samples of motherboards with this kind of finish (customer mistake during pcb order). Normally we can use leaded sold
Electronics Forum | Thu May 29 13:12:10 EDT 2008 | yam6rider
Just like to know what you guys thoughts regarding mixed alloys. Production run SAC305 and some components are SAC105. So, which profile should you follow. SAC105? or SAC305.
Industry News | 2011-02-24 20:35:03.0
The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-09-07 14:38:31.0
A repeat customer specializing in high-technology interconnect, sensor, and antenna solutions, partnered with us to dispense small volumes of solder paste (Indium 10.1 SAC305 T6SG 78%m) onto backplane connectors – gold pads 0.175mm x 0.225mm. We performed a test requiring 0.200mm diameter or smaller dots to demonstrate the dispensing capability required.
ALPHA® Preforms with solder paste adds solder volume.
QYSMT SOLUTION USA LLC / Qinyi Electronics Co.,Ltd | https://www.qy-smt.com/shop/42605601-mac-valve-35a-sac-dacc-1ba-191300?page=143&category=1111
UNIVERSAL Mac Valve : 35A-SAC-DACC-1BA 42605601 | QYSMT × Home about Us ABOUT US FAQ SMT spare parts SMT surplus equipment SMT peripheral equipments News Contact US 0 0 Sign in contact us Products AI SPARE PARTS Mac Valve
Surface Mount Technology Association (SMTA) | https://www.smta.org/knowledge/proceedings_abstract.cfm?PROC_ID=5459
: Department of Physics, Binghamton University Date Published : 9/22/2019 Conference : SMTA International Abstract: Interest has been growing in Sn based solders containing Bi, including SnAgCu solder with up to three weight percent Bi, and in SAC/Sn57Bi1Ag mixed assemblies
