New SMT Equipment: enig black pad (32)

Rigid-flex PCB, Rigid flex circuit board manufacturer, Flex rigid PCB -- Hitech Circuits Co., Limited

Rigid-flex PCB, Rigid flex circuit board manufacturer, Flex rigid PCB -- Hitech Circuits Co., Limited

New Equipment | Fabrication Services

Rigid flex printed circuit boards (PCBs) are manufactured by combining rigid and flexible board technologies. These circuit boards are made up of multiple flexible circuit inner layers. An epoxy pre-preg bonding film is used to attach together these

Hitech Circuits Co., Limited

Multilayer PCB Fabrication

Multilayer PCB Fabrication

New Equipment | Fabrication Services

Multilayer PCB's ACI manufactures a wide variety of Multilayer PCB's for various applications spanning numerous industries and technologies.  We can build your high layer count PCB's using a wide variety of high speed low loss materials from epoxies

Advanced Circuitry International

Electronics Forum: enig black pad (464)

enig

Electronics Forum | Mon Jan 03 16:34:10 EST 2005 | davef

The main advantage if ENIG over HASL is that ENIG is flat and HASL generally is not. The main disadvanages to ENIG over HASL are: * Cost of ENIG is 1.5 - 2X higher than HASL * Selflife is less than HASL * You solder to nickel, rather than copper * E

enig

Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller

We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w

Used SMT Equipment: enig black pad (3)

Assembleon CL, FL

Used SMT Equipment | Pick and Place/Feeders

Normal 0 false false false EN-US X-NONE X-NONE MicrosoftInternetExplorer4

AUE international

Universal Instruments Spare Parts for Thru-hole Inse

Universal Instruments Spare Parts for Thru-hole Inse

Used SMT Equipment | THT Equipment

Spare parts for Universal Radial and Axial through-hole insertion machines Model specifications: (RAD5 6360D, RAD8 6380A, RAD8 XT 6380B, VCD5 6241D, VCD8 6241F, VCD Dual 6292A, SEQ 2596A, SEQ5, SEQ8). UIC Part Number / Part Description 15754 O

Tekmart International Inc.

Industry News: enig black pad (59)

Web-based Seminar on Black Pad to Feature Solectron Tech Leaders

Industry News | 2003-03-14 08:18:03.0

The instruction is intended as a practical user's guide for determining if a failure is related to black pad.

Surface Mount Technology Association (SMTA)

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Parts & Supplies: enig black pad (110)

Juki MTC Nozzle Rubber Head PX500062000 SMT Spare Parts VACUUM PAD

Juki MTC Nozzle Rubber Head PX500062000 SMT Spare Parts VACUUM PAD

Parts & Supplies | Assembly Accessories

Detailed Product Description Brand: JUKI Color: Black Material: Rubber Part Name: Vaccum Pad Part Number: PX500062000 Condition: Original New JUKI MTC Nozzle Rubber Head PX500062000 VACUUM PAD SMT Spare Part Detail Information: 1, Part Name

KingFei SMT Tech

Technical Library: enig black pad (9)

Identification and Prevention of "Black Pad"

Technical Library | 2013-01-17 15:34:33.0

The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.

Jabil Circuit, Inc.

Solving the ENIG Black Pad Problem: An ITRI Report on Round 2

Technical Library | 2013-01-17 15:37:21.0

A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.

Celestica Corporation

Videos: enig black pad (7)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

ACI Technologies Inc. - Commercial Services - Engineering, Manufacturing, Analytical and Electronics Manufacturing Training (IPC Certification Training and Custom Electronics Manufacturing Courses)

Videos

ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service

ACI Technologies, Inc.

SMT On-line 3D Solder Paste Inspection ?

SMT On-line 3D Solder Paste Inspection ?

Videos

SMT On-line 3D Solder Paste Inspection ​ If you could not find any similar items you want, you may send some photos to us. because our catalog and website haven't included all of our products. solder paste inspection,SMT SPI,SPI machine, SPI in

Dongguan Intercontinental Technology Co., Ltd.

Training Courses: enig black pad (3)

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

BGA Rework Process Implementation

Training Courses | | | PCB Rework and Hand Soldering Courses

The PCB rework and hand soldering courses courses cover techniques of rework and repair of PCBs, BGAs and other electronics assemblies, and teach fundamentals of soldering of electronics assemblies.

Precision PCB Services, Inc

Events Calendar: enig black pad (3)

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,

Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies

Surface Mount Technology Association (SMTA)

SMTA China East Conference 2018

Events Calendar | Mon Apr 23 00:00:00 EDT 2018 - Thu Apr 26 00:00:00 EDT 2018 | Shanghai, China

SMTA China East Conference 2018

Surface Mount Technology Association (SMTA)

Career Center - Resumes: enig black pad (2)

resume_srini_chada

Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support

• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a

Technical Resume

Career Center | Toronto, Ontario Canada | Production,Quality Control,Technical Support

HIGHLIGHTS OF QUALIFICATIONS • Over 5 years of experience working as a Technical Support person, Onsite Technician in maintenance and operation of business environment to support business such as inventory of equipments and supplies as well as softw

Express Newsletter: enig black pad (267)

Partner Websites: enig black pad (349)

Q-Pad II Q-Pad 3

ORION Industries | http://orionindustries.com/pdfs/qpad2.pdf

Grease Replacement Materials without Electrical Isolation Physical Properties Q-PAD II Q-PAD 3 Test Method Color Black Black Visual Thickness Inches .006/.0065 w/ac ±.001.005/.0055 (w/ac) ASTM D374 (mm) .152 ±.025 (.15

ORION Industries

MC14-000068 Pad Vacuum -PFG-3.5A Rubber Pad Samsung Sm Nozzle

KingFei SMT Tech | https://www.smtspare-parts.com/sale-14324537-mc14-000068-pad-vacuum-pfg-3-5a-rubber-pad-samsung-sm-nozzle.html

MC14-000068 Pad Vacuum -PFG-3.5A Rubber Pad Samsung Sm Nozzle Leave a Message We will call you back soon! Your message must be between 20-3,000 characters

KingFei SMT Tech


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