Industry News | 2019-11-05 22:19:03.0
> News-Blog > Guideline for wire bonding Guideline for wire bonding Tuesday,Jun 12,2018 There are two wire bonding processes that are used, Thermosonic (T/S) Gold Ball Wire Bonding and Ultrasonic (U/S) Aluminum Wedge Wire Bonding. Approximately 90% of all IC Assembly in Semiconductor Packages is manufactured using Gold Ball Bonding process, while Aluminum Wedge Bonding is used to produce about 10% of other Wire Bonding requirements on Printed Circuit Boards (PCB), Printed Circuit Flex (PCF) and other Packages.
Electronics Forum | Thu Jul 15 06:27:50 EDT 2010 | xps
Hi after an enviromental test 85C/85RH, for 3 months (powered), of an electronic assembly with edge finger tabs ENIG finished (nickel 5micron, gold 0.02micron), the nickel disappears completely under the gold (due to corrosion, I think). Does anyone
Electronics Forum | Mon Jan 04 22:09:57 EST 2016 | a290668789
It's amazing. I rarely saw that ENIG finish could be corroded. It should be the Nickel corroded issue and then affected the solderability. Not clear how to clear this, if you get the answer, let me know. good luck
Electronics Forum | Tue Dec 15 15:21:17 EST 2015 | davef
Peculiar that ENIG boards are corroded, not that it can't happen. * J-STD-002, Solderability Tests for Component Leads, Terminations, Lugs, Terminals and Wires * J-STD-003, Solderability Tests for Printed Boards The first person I'd talk with is my
Electronics Forum | Fri Feb 17 09:08:22 EST 2017 | davef
An interesting paper on the topic is "The evolution of surface finishes in mobile phone applications" by Claus Würtz Nielsen at Nokia Mobile Phones R&D [http://www.cicmt.org/adv_micro/papers/Nordic2004paper.pdf] The paper reported corrosion problem
Electronics Forum | Thu Jul 24 22:58:13 EDT 2008 | davef
At the 2004 IMAPS Nordic Conference, Claus W�rtz Nielsson from Nokia Mobile Phones published "The Evolution of Surface Finishes in Mobile Phone Applications" [www.imaps.org/adv_micro/papers/Nordic2004paper.pdf]. Some of the results were: * Corrosion
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Tue Feb 21 01:32:49 EST 2017 | soldertraining
Looking for advice on soldering lead free paste to a board with very heavy gold plating, In my opinion, Gold contact surfaces are often used on circuit boards with membrane switches which is a choice of technology for industrial, commercial and consu
Electronics Forum | Wed Jun 14 20:49:32 EDT 2006 | davef
We too do not use ENIG. Too expensive and risky. Implementing a Simple Corrosion Test Method to Detect "Black Pad" Phenomenon in Electroless Nickel/Immersion Gold Plating ; BabHui Lee; Circuitree 11/1/03 http://www.circuitree.com/CDA/Archives/34f2b
Electronics Forum | Sat Jul 28 08:37:52 EDT 2007 | davef
There is no good choice. Board Finishes: Industrial/Battelle Class 3 Environment [Reliability Knowledge Gaps: For use of Pb-free solders in High Reliability Applications, J Smetana, iNEMI Availability of SnPb-Compatible BGAs Workshop, March 1, 2007,
