Electronics Forum | Wed Nov 04 11:00:00 EST 2009 | tstrat
That is interesting, I have not seen that as a requirement before. From what I read if it is less than 7 wt% the corrosion resistance is pretty low, but if the value is too high it indicates that "black pad" is present from nickel corrosion. From wha
Electronics Forum | Thu Aug 25 17:24:44 EDT 2016 | davef
Gold should not be corroding in salt water. I have swum hundreds of miles in salt water with my wedding ring on my finger. My ring is a shiny and corrosion-free as the day it was cast over 120 years ago. It's possible that your gold thickness of 0.0
Electronics Forum | Wed Feb 01 18:11:43 EST 2006 | Chris
I wonder if they are concerned about getting chemicals trapped in the tented vias. If the tented vias have pin hole openings or even larger openings, chemicals from the ENIG process could become entrapped in the via holes and not washed away in the
Electronics Forum | Thu Aug 29 09:55:37 EDT 2002 | davef
Sounds like hyper-corrosion of nickel, commonly referred to as 'black pad', in ENIG solderability protected boards. Search the fine SMTnet Archives to get started. Additionally, the July - September 2002 'Journal Of Surface Mount Technolgy' has an
Electronics Forum | Thu Aug 25 18:14:10 EDT 2016 | davef
Shawn ... I believe you. I believe what you're saying. I don't believe that you received the metals that you ordered. From the way it looks I'd guess that you have no nickel and that you're seeing copper corrosion.
Electronics Forum | Wed Aug 24 16:30:11 EDT 2016 | shawn_halo_1
I have a 1oz Flex PCB (FPC) that has 2 0.4mm pitch connectors that need to be SMTd and 9 4.5x1.0mm pads that have conductive rubber contacts that are press fitted onto the FPC. The FPC has a one time bend radius of 15.5mm. Image is attached that show
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
Electronics Forum | Fri Jul 15 16:50:04 EDT 2005 | davef
Few of us here on SMTnet fabricate our bare boards. Most of us are assemblers. So, the solderability of the connections of our boards is a BIG issue with us. Our suppliers protect the solderability of the copper by coating the copper to limit the
Electronics Forum | Wed Nov 04 13:15:53 EST 2009 | tstrat
I asked our lab about this and received this response: "Typically 7 - 9wt% phosphorus is used. Higher concentrations (10 - 12 wt% phosphorus) reportedly help prevent Ni-P corrosion during the IG processing step, but they are also reportedly more dif
Electronics Forum | Mon Apr 27 14:39:38 EDT 2015 | davef
Anirudh: When board fabs talk "surface finishing" they're talking about the solderability protection that you'd like on the solderable copper component mounting pads that you laid-out for each component: * Bare copper pads corrode very quickly * Corr
