Full Site - : enig poor solder flow (Page 11 of 16)

Re: BGA problem: open after reflow

Electronics Forum | Wed Jan 17 20:48:14 EST 2001 | davef

We find that the raw BGA's pad sheared surface has the SnPb solder at various Z heights whereas the assembled BGAs pad leave a smooth layer of SnPb along the pad. Like to understand the cause for the difference. Who could guess? Solder joint streng

Re: Calibration

Electronics Forum | Thu Jun 25 18:17:26 EDT 1998 | Earl Moon

| What is the industry standard for calibration compliance certification of SMT machines? and Flow Solder machines? | We are currently doing a Quality Audit on one of our manufacturing venders and this questions has been brought up. | Any help would

Solder wetting to ENIG pads

Electronics Forum | Wed May 14 12:35:34 EDT 2008 | rgduval

Thanks, Chunks. That's the one point of the experiment that we haven't tried yet. Though, we came to the same conclusion just yesterday. Dave, so far, the most help we've gotten was from the paste manufacturer. I've involved the board house, but

Re: Bottom side bridging

Electronics Forum | Fri Apr 10 20:35:59 EDT 1998 | Steve Gregory

| | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. T

Re: Bottom side bridging

Electronics Forum | Mon Apr 13 08:42:32 EDT 1998 | Bob Silveri

| | | | We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no proble

Air Moisture in Production

Electronics Forum | Wed Dec 08 11:26:04 EST 2010 | davef

3 Printer Area Conditions * As stated earlier, heat and humidity are damaging to solder paste. Ideally, the printing area should be maintained at 40% - 50% relative humidity and 72°- 80°F (22-26°C). In addition, no air (cool or warm) should blow dire

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 10:02:06 EDT 1999 | Chrys Shea

| | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VIA hole

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Fri Jun 04 17:10:59 EDT 1999 | C.K.

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: Wave Solder Problems - VIA HOLES

Electronics Forum | Tue Jun 08 11:40:03 EDT 1999 | Steve Skinner

| | | I'm encountering a new problem at my new company that I haven't encountered before in my past life - and that's Wave Soldering VIA holes. | | | | | | We've been getting a rash of defects that we call in this company, "insufficient solder in VI

Re: Detecting lifted leads on QFPs

Electronics Forum | Sun May 30 08:50:42 EDT 1999 | Dave F

| Yes l know this problem keeps cropping up on the forum but l've missed some of the follow-ups. | | Our problem is that the lifting only occurs on 3% of production so actually detecting an improvement is difficult. We're actually having to inspect


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