Electronics Forum | Tue Apr 15 21:24:41 EDT 2008 | davef
We find it curious that: * Heat slug pad for Q19 didn't take solder, indicating a pad [board] solderability issue. * Signal termination pads for Q19 didn't flow well, indicating a poor thermal recipe or a pad [board] solderability issue. * Signal ter
Electronics Forum | Tue Aug 02 15:02:50 EDT 2016 | davef
ASPIS (Advanced Surface Protection for Improved Reliability PCB Systems) The three year Aspis ‘Research for SMEs’ project has been conducted to address problems found with the nickel gold (ENIG) solderable finishes that are used by the electronics in
Electronics Forum | Wed Mar 15 20:28:17 EST 2000 | Dave F
Armin: Locating vias within the courtyard of components is bad practice. Concerns are: * Poor solder paste print quality, caused by the via preventing good stencil gasketing. * Poor component reflow, caused by the via holding the component out o
Electronics Forum | Wed Nov 19 10:47:37 EST 2014 | grahamcooper22
Probably not all the overpinted paste is flowing onto the joint. You may need a paste with great coalescence properties so it all flows together, and doesn't leave any on the resist. Does the paste drip out the through hole too ? If so it suggests it
Electronics Forum | Wed Jun 29 17:18:41 EDT 2005 | GS*
Very interesting tread, many thanks to all. Matt please, now what does it mean for you? Will your custmer accept dull solder joints or will the plating be changed ? (ie. HASL, ENIG, etc) Tnks and regards GS*
Electronics Forum | Thu Mar 06 15:33:42 EST 2008 | realchunks
I hear that. A 2002? You poor b-stard! That's like having cold solder joints! (Gotta keep it related)
Electronics Forum | Mon May 26 09:31:41 EDT 2008 | davef
What steps are taken in low residue wave soldering to assure the proper amount of flux is applied prior to soldering? * Too little flux can result in poor solder flow. * Too much flux can result in corrosive residues left on the board after soldering
Electronics Forum | Tue Mar 16 16:59:09 EDT 2010 | davef
Most often 'solder graping' refers to poor solder wetting, where the solder paste has partially melted, but has not coalesced or flowed. Sometimes this leaves the outline of the partially melted solder balls still visible, giving the appearance, to
Electronics Forum | Wed Dec 15 21:29:34 EST 2004 | davef
We�d say that it�s incorrect that ENIG solderability protection cannot be steam aged. It�s true the immersion tin and silver cannot be steam aged. We believe that most of the issues surrounding the poor performance of ENIG after steam aging is attr
Electronics Forum | Wed Oct 19 22:48:18 EDT 2016 | thaneshsivanadian
Hi All, Currently im seeing a cold solder/ poor wetting underneath the BGA Ball as i shown in the attachment. From the attachment you also can see one ball with poor wetting and another ball with a good wetting. When i checked with my re-flow profil
