Electronics Forum | Sun Jul 29 08:36:39 EDT 2001 | davef
You have provided very little information. Two similar possibilites come to mind: poor pad solderability protection and old boards. POOR SOLDERABILITY PROTECTION: Maybe the nickel plating under the gold is oxidized, contaminated, or otherwise very
Electronics Forum | Mon Oct 18 11:48:57 EDT 1999 | Dave F
No, but answer me this? 1 What type of BGA? 2 What's the wave process, materials and temps? Are you waving the BGA or top-side flowing it? 3 If the BGA is plastic, what are you doing to prevent/remove entrapped moisture before solder processing?
Electronics Forum | Fri Oct 16 12:41:29 EDT 2015 | deanm
Do you have a solderable surface (walls)? It looks like most walls have a silver arc at the top but some do not (especially the last link) which I interpret that it has been plated (in most cases). Is it possible that the component does not have suff
Electronics Forum | Wed Jun 29 06:57:20 EDT 2005 | mattkehoe
Hi Bob, We tried flowing the pads with a soldering iron. The pad at the tip of the iron went shiny but as soon as the iron was taken away, the pad returned to the dull finish. You could actually move the tip around the pad and it would shine up then
Electronics Forum | Wed Jul 23 08:37:02 EDT 2003 | davef
Your fabricator should be able to re-apply the imm tin very easily. Actually, if we had boards like you describe [and we were sure we didn't mess them up], we'd be be making strong implications that our fab would need to make this right. Don't pin
Electronics Forum | Mon Oct 25 21:49:14 EDT 2004 | davef
First, any results of pull or shear tests are unscientific at best. [We pop our BGA from boards with, appropriately enough, a beverage can opener.] Second, we have no have problems with your ENIG specification. Third, as with your customer, we'd e
Electronics Forum | Mon Feb 23 05:37:23 EST 2009 | emmanueldavid
Necoleta, PWB Blistering/De-lamination may not be due for Titanium finished threads / holders which is typically being used to draw high Shelf Life of Pallets and even flow across Auto Wave Soldering rails. There is also nothing to suspect on Liquid
Electronics Forum | Wed Feb 05 10:31:38 EST 2003 | bpan
Hello Everyone, Is anyone out there building smt boards that have plated through vias directly located through the pads. We are seeing some of these designs and the soldering is very poor because the solder is flowing through the via. We think that w
Electronics Forum | Fri Aug 08 08:34:28 EDT 2003 | mleber
Problem areas are always ground connections. 20 pin dips have great flow on 18 of 20 pins, caps have poor upflow on the ground side only etc. That's my problem. 90% of the pwb looks great. Bottomside - awesome. Ground connections do not meet the 75%
Electronics Forum | Fri Dec 12 11:02:20 EST 2008 | patrickbruneel
Greg, I totally agree with you that machine settings are very important in wave soldering and soldering in general. I disagree that lead free alloys can produce wetting like in the attached picture (leaded alloy). Lead free alloys have a much higher
