Electronics Forum | Tue Jan 04 12:37:41 EST 2005 | Cmiller
We have been using this finish almost exclusively for fine pitch boards for about 5 years. Make SURE you use a board house that does the gold plating in-house. There are some potential issues as DaveF stated. The only problem we have encountered is w
Electronics Forum | Fri Jul 13 12:32:14 EDT 2007 | rgduval
We've experienced this issue with SN100. A couple of things we've tried, all with varying levels of success: 1. Longer pre-heats. We use SN100 in a solder pot, and pre-heat the boards on our wave machine. This did have a positive effect, but I ne
Industry News | 2011-02-24 20:35:03.0
The SMTA is pleased to announce the program for the 2011 International Conference on Soldering and Reliability being held May 3-6 in Toronto, Ontario, Canada.
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
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SMTnet Express, January 23, 2014, Subscribers: 26486, Members: Companies: 13559, Users: 35667 Testing Intermetallic Fragility on Enig upon Addition of Limitless Cu by Martin K. Anselm, Ph.D. and Brian Roggeman; Universal Instruments Corp
Imagineering, Inc. | https://www.pcbnet.com/blog/how-pcbs-are-made/
. Small imperfections in copper traces can lead to problems with signal integrity, component compatibility, manufacturability, and functionality
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