Used SMT Equipment | AOI / Automated Optical Inspection
Table top - high speed AOI capable of even the highest technologies, 01005 M22XDL-460 Desktop AOI inspects SMT and PTH components (presence, type, polarity, offset, text, etc.) and reflow and wave solder joints (including meniscus). Provides 2-D so
FOR SALE: Marantz Christopher NSpec 22X DL is a table top AOI for pcb inspection. This unit is capable of inspecting for presence, type, polarity, offset, text, etc. It is also capable of solder joint analysis and 2d solder paste inspection. This
Industry News | 2013-04-26 13:53:25.0
The Balver Zinn Group announces that Cobar Solder Products Inc. has introduced its new 95 RX Flux Series.
New Equipment | Coating Materials
Technic Releases TechniFlex LCL1000F/423M New Flexible Black Soldermask for Direct Imaging Cranston, RI, USA - Technic has announced the release of TechniFlex LCL1000F/423M, an extremely durable, direct imaging, fine pitch, matte black solder mask
New Equipment | Fabrication Services
High frequency RF, Microwave Printed Circuit Board Design, FAB PNC can provide you with your High Frequency RF PCB and Microwave PCB needs. Our advanced Technologies have made us a leader in the RF/Microwave PCB industry processing FR4 and Rogers Ma
Industry News | 2019-01-22 12:31:14.0
Nordson YESTECH will feature the latest revision of the FX-942 dual sided automated optical inspection (AOI) system for solder and plated through-hole (PTH) applications at the 2019 IPC APEX EXPO in San Diego, CA. During the exhibition, Nordson YESTECH will conduct live demonstrations in the booth of their complete line of AOI and Conformal Coat inspection (ACI) systems
Layers: 1-20L Material Types: FR-4, High TG, Halogen Free Max.Panel Dimension: 530mm*622mm Outline Tolerance: ±0.10mm Board Thickness: 0.40mm-3.20mm Board thickness Tolerance(t=0.8mm):±10% Width: 0.10mm Spacing: 0.10mm External: 35um-140um Int
Technical Library | 2013-01-17 15:34:33.0
The use of an electroless nickel, immersion gold (ENIG) surface finish comes with the inherent potential risk of Black Pad failures that can cause fracture embrittlement at the interface between the solder and the metal pad. As yet, there is no conclusive agreed solution to effectively eliminate Black Pad failures. The case studies presented are intended to add to the understanding of the Black Pad failure mechanism and to identify both the plating and the subsequent assembly processes and conditions that can help to prevent the likelihood of Black Pad occurring.
sales5_at_etlimited_cn Halogen free PCB,PCB boards, PCB prototype, pcb solder mask,FREE PCB Key speciafications/special features: 8 layers PCB Base material: Ceramics, Aluminum, Rogers, high Tg, F4B, F4B
Technical Library | 2014-08-07 15:13:44.0
Gold embrittlement in SnPb solder is a well-known failure mechanism in electronic assembly. To avoid this issue, prior studies have indicated a maximum gold content of three weight percent. This study attempts to provide similar guidance for Pb-free (SAC305) solder. Standard surface mount devices were assembled with SnPb and SAC305 solder onto printed boards with various thicknesses of gold plating. The gold plating included electroless nickel immersion gold (ENIG) and electrolytic gold of 15, 25, 35, and 50 microinches over nickel. These gold thicknesses resulted in weight percentages between 0.4 to 7.0 weight percent.
