New Equipment | Surface Finish
Technic supplies precious metal and tin and tin alloyed products that are used to preserve as well as enhance soldering and bonding through all levels of interconnection. Technic is well established as a leader in Final Finish Solutions for printed
New Equipment | Fabrication Services
Flex part 2Layer PCB Polymid PCB thickness: 0.15mm Yellow coverlayer White Silkscreen Surface treatment: ENIG Min Line/space: 6/6mil Min hole: 4mil Rigid part 6Layer PCB PCB thickness: 0.8mm Green solder mask White Silkscreen Surface treatment: ENIG
The XT-1300 is an automatic x-ray inspection system, designed for the inspection of automotive modules and complete assemblies. In addition to the typical joint inspection the system also supports the joint inspection on flexible printed circuit boar
With the development of miniaturization of assembly components, the layout area and pattern design area of PCBs have also been continuously reduced, and PCB manufacturers are constantly updating the production process to conform to the development tr
New Equipment | Board Handling - Pallets,Carriers,Fixtures
* Permits wave solder of PTH components for double sided and mixed technology assemblies * Protects solder side surface mount devices (SMD) * Shields sensitive components and non-glued parts from heat and solder paste
Double-Sided & Multi-Layer PCB Material: - FR-4 / Hi-Temp FR-4 / FR-5 / G10 / BT / Polyimide - Very Thin PCB: 0.004" 2L ~ 0.030" 8L - Thick Copper: 1/4 oz. ~ 11 oz. Process: - PTH - Blind/Buried/Segmented Via - Sequential Lamination - MicroVia Capa
Industry News | 2008-10-29 17:30:39.0
Greeley, CO � October 2008 � Florida CirTech Inc., a leading chemical blender to the Printed Circuit and Electronic Assembly industry, announces that it recently developed the CK300 - Catalyst Killer.
Technical Library | 2023-01-10 20:03:37.0
Since the IPC-4552 rev A for ENIG was introduced there have been many requests for clarification of acceptable and unacceptable levels of nickel corrosion. This paper attempts to further clarify the effects of nickel corrosion on solder wetting balance test results and the resultant intermetallic formed. The study will attempt to produce level 1, level 2, and level 3 corrosion as denoted by IPC-4552 rev A and tabulate wetting balance results and congruity of intermetallic formed.
The system features high clearance for assemblies with up to 300mm height. Main application is the foil and PTH inspection. X-ray system features Inspection program control system with automatic defect detection and defect verification capability
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