New Equipment | Assembly Services
PNC Inc. has been manufacturing hi-reliability printed circuit boards since 1968. All Military Spec PC boards are manufactured in the security of our Nutley NJ, USA facility. PNC is certified by the Department of Defense to Military Performance Speci
Technical Library | 2013-01-17 15:37:21.0
A problem exists with electroless nickel / immersion gold (ENIG) surface finish on some pads, on some boards, that causes the solder joint to separate from the nickel surface, causing an open. The solder has wet and dissolved the gold. A weak tin to nickel intermetallic bond initially occurs, but the intermetallic bond cracks and separates when put under stress. Since the electroless nickel / immersion gold finish performs satisfactory in most applications, there had to be some area within the current chemistry process window that was satisfactory. The problem has been described as a 'BGA Black Pad Problem' or by HP as an 'Interfacial Fracture of BGA Packages…'[1]. A 24 variable experiment using three different chemistries was conducted during the ITRI (Interconnect Technology Research Institute) ENIG Project, Round 1, to investigate what process parameters of the chemical matrix were potentially satisfactory to use and which process parameters of the chemical matrix need to be avoided. The ITRI ENIG Project has completed Round 1 of testing and is now in the process of Round 2 TV (Test Vehicle) build.
New Equipment | Rework & Repair Services
Many Fortune 500 clients, and numerous other OEMs and contract manufacturers of micro-electronics rely on Process Sciences to service, modify, reclaim, upgrade, and/or repair their circuit assemblies and array devices. PSI knows solder! Please rememb
New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
Industry News | 2012-01-03 10:40:18.0
Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.
1-22 Layers PCBs FR-4, Rogers, High Tg FR4, CEM-1, CEM-3, etc. Material 0.4-6.0 mm Board Thickness Lead Free HASL, ENIG, Immersion Tin, Immersion Silver, OSP etc. Treatment Green, Red, White, Yellow, Black, Blue Solder Mask
Layer: Single-Sided Price：USD275.50 Quantity :3Panel Min Holes：2.00mm surface Treatment:ENIG solder mask:White silk screen : Black Board Thickness: 1.6mm Cu Thickness: 35um Aluminium Model: 5052 Thermal Conductivity: 150W/m. K Breakdown Voltage:
Layer: Single-Sided Price：USD295.50 Quantity :10pcs Min Holes：2.00mm surface Treatment:ENIG solder mask: Black silk screen :White Board Thickness: 3.0mm Cu Thickness: 70um Thermal Conductivity: 220W/m. K Breakdown Voltage: AC2KV-7KV
New Equipment | Fabrication Services
Material: FR-4 Board thickness: 2.4mm Copper thickness: 140um/4oz Surface finishing: Immersion Gold (ENIG) Solder mask: blue, green, yellow, white, red, black, purple Application: UPS, power supply, convertor, motor For your board, feel free t
