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The SMTA membership is a network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies and related business operations.
Flux Free Formic Reflow Reflow in Formic Acid Vapor Heller has designed and built an production ready horizontal reflow oven for formic acid vapor. This new oven has been designed to meet Semi S2/S8 safety standards (including toxic gases). Form
Dual Chamber Module - Dual Chambers + Dual Blowers + Dual Heaters + Dual T/Cs. Bifurcated (Dual) chamber reflow oven allows 2 different thermal profiles to run simultaneously in the same reflow oven foot print Improved temperature uniformity acro
Electronics Forum | Tue Feb 13 15:56:16 EST 2007 | darby
Campos, This is a direct reply I recieved from Indium, (thanks to Rich Brooks), in late 2004 regarding SMQ230. I have followed these guidelines with good results using ENIG finish. Same also applies to Indium 5.1 apply to both alloys (SAC 387 and 305
Electronics Forum | Tue Feb 19 09:24:25 EST 2019 | cyber_wolf
Reflow profiles are based on the product and materials you are soldering. You need profiling software and a data logger.
Used SMT Equipment | Soldering - Reflow
Heller REFLOW OVEN MK3 2013 Condition: 2013 USED Standard type Feel free to contact me if interested!! Availability: Available on backorder The 1800 models support high mix / high volume throughput… at speeds up to 32 inches (80 centimeters) per min
Used SMT Equipment | Soldering - Reflow
Details: • Edge Rail and Mesh Belt Conveyors • Auto Oiler • On Board Profiler • 208/240V • Air Condition: Complete & Operational *** Very low usage hours*** Location & Shipping: USA / FOB Origin Av
Industry News | 2013-08-15 20:58:22.0
Heller Industries announced today that they have entered into a joint development agreement with International Business Machines Corporation (NYSE: IBM), to collaborate on the development of fluxless mass reflow furnace equipment and process for high volume manufacturing. The fluxless process utilizes gas phase formic acid to replace standard fluxing agents, and eliminates the need for pre-reflow fluxing and post-reflow flux cleanup steps.
Parts & Supplies | Assembly Accessories
Qinyi Electronics Co.,Ltd
Parts & Supplies | Assembly Accessories
KIC START2 PROFILER Specifications: KIC Start 2 Profiler * Replacement of KIC Start * Stainless Steel Thermal Shield * 6 Channels (Standard Type K TC connectors) KIC Start 2 Thermal Profiler KIC K2 thermal profiler,smt reflow oven therma prof
Technical Library | 2023-01-17 17:27:13.0
Reflow profile has significant impact on solder joint performance because it influences wetting and microstructure of the solder joint. The degree of wetting, the microstructure (in particular the intermetallic layer), and the inherent strength of the solder all factor into the reliability of the solder joint. This paper presents experimental results on the effect of reflow profile on both 63%Sn 37%Pb (SnPb) and 96.5%Sn 3.0%Ag 0.5%Cu (SAC 305) solder joint shear force. Specifically, the effect of the reflow peak temperature and time above solder liquidus temperature are studied. Nine reflow profiles for SAC 305 and nine reflow profiles for SnPb have been developed with three levels of peak temperature (230 o C, 240 o C, and 250 o C for SAC 305; and 195 o C, 205 o C, and 215 o C for SnPb) and three levels of time above solder liquidus temperature (30 sec., 60 sec., and 90 sec.). The shear force data of four different sizes of chip resistors (1206, 0805, 0603, and 0402) are compared across the different profiles. The shear force of the resistors is measured at time 0 (right after assembly). The fracture surfaces have been studied using a scanning electron microscopy (SEM) with energy dispersive spectroscopy (EDS)
Technical Library | 2023-01-17 17:19:44.0
A test program was developed to evaluate the effectiveness of vacuum reflow processing on solder joint voiding and subsequent thermal cycling performance. Area array package test vehicles were assembled using conventional reflow processing and a solder paste that generated substantial void content in the solder joints. Half of the population of test vehicles then were re-processed (reflowed) using vacuum reflow. Transmission x-ray inspection showed a significant reduction in solder voiding after vacuum processing. The solder attachment reliability of the conventional and vacuum reflowed test vehicles was characterized and compared using two different accelerated thermal cycling profiles. The thermal cycling results are discussed in terms of the general impact of voiding on solder thermal fatigue reliability, results from the open literature, and the evolving industry standards for solder voiding. Recommendations are made for further work based on other void reduction methods and additional reliability studies.
Nano-copper sintering in formic acid vapor.
1809 MK5 - Heller Advanced In-Line Vacuum Reflow Oven Nitrogen System with Balanced Flow Technology 9 Top And Bottom Heated Zones - highest zone count per linear foot in the industry! 100" Heated Length - for super throughput! 2 Internal C
Training Courses | | | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Training Courses | ONLINE | ON DEMAND | PCB Assembly Courses
The PCB assembly courses provide knowledge of different processes and equipment used in TH and SMT assembly of printed circuit boards.
Events Calendar | Wed Feb 21 00:00:00 EST 2024 - Wed Feb 21 00:00:00 EST 2024 | Menomonee, Wisconsin USA
Wisconsin Chapter In-Person PCBA Profile Workshop
Events Calendar | Wed Jun 22 00:00:00 EDT 2022 - Wed Jun 22 00:00:00 EDT 2022 | ,
Empire Chapter Webinar: LIVE Action Reflow Focused Process
Career Center | , | 2001-05-16 16:03:48.0
Work with a fast growing, leading edge technology manufacturer. Must know fluid dispensing profiling screen printing reflow Pay is market agnencies: will split
Career Center | Rancho Cucamonga, California USA | Production
The successful candidate will have at least one year experience and knowledge in Pick and Place programming for machines such as Fuji, Samsung, Panasonic, or Tyco; stencil printing and solder past knowledge; wave solder and wave solder washing proce
Career Center | Phoenix, Arizona | Engineering,Management,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
• Highly motivated, solution oriented professional with proven record synergizing scientific, engineering, and business administration backgrounds to drive and sustain customer satisfaction and long term improvements. • Articulate communicator that a
Career Center | , India | Engineering,Production,Quality Control,Research and Development,Sales/Marketing,Technical Support
I am working as lab chemist and also involved in troubleshooting and process control of various processes in pcb industry
Heller Industries Inc. | https://hellerindustries.com/heller/vacuum-profile-reflow/
How To Set Up Vacuum Assisted Reflow Profile Home » Heller Blog » Tips for Setting Up an Optimized Vacuum Profile when Using Vacuum Assisted Reflow Tips for Setting Up an Optimized Vacuum Profile when Using Vacuum Assisted Reflow With
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