Industry News | 2018-02-19 13:55:53.0
IPC — Association Connecting Electronics Industries® Pb-free Electronics Risk Management (PERM) Council has developed the first single document dedicated solely to assisting design engineering in the development of electronics that are completely lead-free (Pb-free) and meet the demanding requirements of aerospace, defense and high performance (ADHP) products and systems.
Events Calendar | Wed Apr 20 00:00:00 EDT 2022 - Wed Apr 20 00:00:00 EDT 2022 | ,
Virtual Course: Selection Criteria of Surface Finish for Next Generation PCB Technologies
The natural sustainable desiccant solution for moisture controlled packaging Desiccants are hygroscopic (moisture-adsorbent) substances that are packaged and used to protect a broad range of products from degradation due to moisture, helping to main
The natural sustainable desiccant solution for moisture controlled packaging Desiccants are hygroscopic (moisture-adsorbent) substances that are packaged and used to protect a broad range of products from degradation due to moisture, helping to main
ACI Technologies Inc. (ACI) is a scientific research corporation dedicated to the advancement of electronics manufacturing processes and materials for The Department of Defense and industry. This video provides an overview of our commercial service
New Equipment | Design Services
ACI maintains a proven track record of assisting Department of Defense program acquisition offices in the identification and solution of manufacturing technology issues affecting major weapons, aviation, and shipboard systems. Our staff of engineers
Industry News | 2011-12-21 22:41:39.0
Offering convenient and cost-effective staff development, IPC announces its Winter Webinar Series for January, February and March 2012. The one-hour webinars which focus on critical issues facing the industry, offer companies an opportunity to bring IPC technical information to a large number of employees at one time.
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2012-05-30 18:23:07.0
IPC Midwest Conference & Exhibition™ will highlight advances in assembly materials, assembly processes and reliability testing to help electronics companies address critical challenges in manufacturing defect-free, quality electronics
Industry News | 2017-10-05 12:40:41.0
The new whitepaper highlights the specific benefits of bentonite clay in terms of composition, moisture-adsorption performance, production requirements, and the environmental impact of available moisture controlled packaging solutions.
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