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MAXWELL ANNOUNCES FIRST EVER AUTOMATED INTEGRATED RELIABILITY TEST SYSTEMS FOR ADVANCED WIRELESS SEMICONDUCTOR COMPONENTS

Industry News | 2002-05-16 16:53:54.0

New Family of 12 Automated Accelerated Reliability Test Systems (AARTS) Starting at $99K

Maxwell Technologies, Inc.

Krayden Debuts Dow Corning Solar Solutions’ Solar Junction Box and Frame Sealing Using Reactive Silicone Hot Melts

Industry News | 2010-06-04 17:32:40.0

DENVER — Krayden, Inc., a leading silicone supplier that specializes in technical knowledge and support for high tech-based applications, introduces Dow Corning Solar Solutions’ PV InstantSeal. This silicone reactive hot melt supports higher-speed assembly with instant green strength, offering productivity improvements in both solar frame and junction box sealing.

Krayden Inc.

AIM Solder to Exhibit NC259 Solder Paste at SMT Hybrid Packaging 2013

Industry News | 2013-03-18 17:06:13.0

AIM Solder announces that it will highlight its new NC259 Solder Paste in representative smartTec GmbH’s booth, which is located in Hall 7, Booth 219 at the upcoming SMT Hybrid Packaging exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

AIM Solder

AIM to Showcase NC259 Solder Paste at the 2013 Del Mar Show

Industry News | 2013-04-01 09:02:49.0

AIM Solder today announced that it will highlight its new NC259 Solder Paste in Booth #554-556 at the Del Mar Electronics & Design Show (DMEDS), scheduled to take place May 1-2, 2013 at the Del Mar Fairgrounds in San Diego, CA

AIM Solder

AIM Solder Brings Low-Cost, Lead-Free Solder Paste to NEPCON China 2013

Industry News | 2013-04-08 19:29:43.0

AIM Solder will highlight its new NC259 Solder Paste in Booth #1A26 at NEPCON China 2013, scheduled on the 23rd - 25th of April, 2013 at the Shanghai World EXPO Exhibition & Convention Center.

AIM Solder

Henkel CSP and BGA Underfills

Henkel CSP and BGA Underfills

New Equipment | Materials

Henkel offers innovative capillary flow underfill encapsulants for flip-chip, CSP and BGA devices. These are highly flowable, high purity, onecomponent encapsulants. They form a uniform and void-free underfill layer to improve reliability performance

Henkel Electronic Materials

Sanmina-SCI Installs ICON-SCM Supply Chain Management Software

Industry News | 2003-04-09 09:05:06.0

ICON Industry Consulting, Inc., a supply chain management solution specialist, today announced Sanmina-SCI Corporation (Nasdaq: SANM), a leading supplier of integrated design and electronics manufacturing solutions (EMS), is using ICON's SCM software to significantly improve production efficiency in a number of its fulfillment centers.

Sanmina-SCI

parvus Corp.'s PC/104-Plus Power Interface Generates 3.3Volts for PC/104-Plus Peripherals

Industry News | 2003-06-04 14:52:19.0

PC/104-Plus Power Interface Converts PCI and ISA Voltages and Provides Thermal Management via Dual Onboard Fans and Temperature Sensor

Parvus Corporation

New Thermostat-Controlled PC/104 Fan Card with Temperature, Humidity and Pressure Sensors Can Boost Reliability of Embedded Computer Systems

Industry News | 2003-11-05 12:57:14.0

Parvus� Environmental Fan Card II Offers Solution for Thermal Management and Environmental Monitoring of Electronic Devices in Military, Industrial and Transportation Applications

Parvus Corporation

PC/104 Thermal Management Card from Parvus Now Integrates Real-Time Clock and Scratch Memory for Time-of-Use Applications

Industry News | 2004-04-05 12:16:15.0

Parvus' Environmental Fan Card II now provides embedded systems with elapsed time counter, unique serial number, force-air cooling, and monitoring of humidity, temperature and air pressure conditions

Parvus Corporation


enig shelf life searches for Companies, Equipment, Machines, Suppliers & Information

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