Industry Directory | Distributor / Manufacturer / Manufacturer's Representative
Specializing in Xray Fluorescence, Eastern Applied offers XRF solutions for RoHS testing, thin gold measurements (ENIG, ENIPIG), solder analysis, and much more. Authorized Distributor of Hitachi High-Tech XRF analyzers.
Industry News | 2012-01-03 10:40:18.0
Technic has announced the release of Technic EN AT5600, an electroless nickel developed specifically to eliminate black pad and to improve soldering on ENIG coated PCBs. Technic EN AT 5600 is the first electroless nickel that provides lateral growth on copper, yielding a flatter surface with less pronounced grain boundaries instead of the typical nodular, "cauliflower-like" structure from older formulas.
Industry Directory | Media / Publisher / Online Resource
ERAI is an information services organization that monitors, investigates and reports issues that are affecting the electronics supply chain.
Anti-skid cut-off finger cots(powder free) Description: Raw materials: 100% pure natural latex;Without plasticizers,silicone oil and amide. Powder-free;Chlorinated-yellow Transparent, Anti-static treated,Textured tip ,Rimless, Unrolled,Class 10 cl
100% (Test method GB-T7753-87) Storage Details Store under normal conditions of 10° to 30°C and 40 to70% R.H. in their initial packaging. Shelf life is 6 months from the date of
Quick Overview: A full range of various dry storage cabinets ensures that your production is based on the IPC/JEDEC Standard STD-033B for moisture sensitive devices. To get more informations form below link: http://www.1clicksmt.com/products/desic
Quick Overview: A full range of various dry storage cabinets ensures that your production is based on the IPC/JEDEC Standard STD-033B for moisture sensitive devices. To get more informations form below link: http://www.1clicksmt.com/products/desic
Quick Overview: A full range of various dry storage cabinets ensures that your production is based on the IPC/JEDEC Standard STD-033B for moisture sensitive devices. To get more informations form below link: http://www.1clicksmt.com/products/desic
Technical Library | 2021-01-28 01:55:00.0
Printed circuit board surface finishes are a topic of constant discussion as environmental influences, such as the Restriction of Hazardous Substances (RoHS) Directive or technology challenges, such as flip chip and 01005 passive components, initiate technology changes. These factors drive the need for greater control of processing characteristics like coplanarity and solderability, which influence the selection of surface finishes and impact costs as well as process robustness and integrity. The ideal printed circuit board finish would have good solderability, long shelf life, ease of fabrication/processing, robust environmental performance and provide dual soldering/wirebonding capabilities; unfortunately no single industry surface finish possesses all of these traits. The selection of a printed circuit board surface finish is ultimately a series of compromises for a given application.
Technical Library | 2022-03-02 21:26:51.0
The solderability of a nickel-palladium-gold (Ni-Pd-Au) finish on a Cu substrate was evaluated for the Pb-free solder, 95.5Sn-3.9Ag-0.6 Cu (wt.%, abbreviated Sn-Ag-Cu) and the eutectic 63Sn-37 Pb (Sn-Pb) alloy. The solder temperature was 245ºC. The flux was a rosin-based mildly activated (RMA) solution. The Ni-Pd-Au finish was tested in the as-fabricated condition as well as after exposure to one of the following accelerated storage (shelf life) regiments: (1) 33.6, 67.2, or 336 hours in the Battelle Class 2 flowing gas environment or (2) 5, 16, or 24 hours of steam aging (88ºC, 90%RH).
