Industry News | 2012-01-17 11:05:35.0
Practical Components introduces a test board for its dummy (mechanical sample) version of Amkor’s cutting-edge 0.3 mm pitch CVBGA. Amkor’s new semiconductor device is a wafer-scale package in a miniature package, which is suitable for installation in surface mount technology (SMT). Amkor’s ChipArray® range of packages consists of laminate-based ball grid array (BGA) packages that are compatible with established SMT mounting processes.
New Equipment | Cleaning Agents
LONOX® L5611 is a solvent-based cleaner for misprinted boards and stencils. It is effective on a wide variety of flux, solder paste and uncured adhesives. Easy to use, L5611 is intended to be diluted with water and effective at ambient temperature t
New Equipment | Cleaning Agents
220°F~104°C Boiling Point 280°F~138°C Water Soluble Complete VOC, @10% 90.0 g/L Typical Processes: Application Spray
New Equipment | Cleaning Agents
220°F/104°C Boiling Point 240°F/115°C Water Soluble Complete VOC, @10% 88.9 g/L Typical Processes: Application In-Line
With a combination of specialized processes and equipment, the boards were custom manufactured from double-sided glass-reinforced PTFE. This PCB is used for controlled impedance within a microwave application.. Utilizing advanced photolithography a
Industry News | 2009-05-18 17:19:51.0
GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.
Industry News | 2009-05-20 19:17:30.0
GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.
Technical Library | 2021-04-08 00:30:49.0
As the electronic industry moves to lead-free assembly and finer-pitch circuits, widely used printed wiring board (PWB) finish, SnPb HASL, has been replaced with lead-free and coplanar PWB finishes such as OSP, ImAg, ENIG, and ImSn. While SnPb HASL offers excellent corrosion protection of the underlying copper due to its thick coating and inherent corrosion resistance, the lead-free board finishes provide reduced corrosion protection to the underlying copper due to their very thin coating. For ImAg, the coating material itself can also corrode in more aggressive environments. This is an issue for products deployed in environments with high levels of sulfur containing pollutants encountered in the current global market. In those corrosive environments, creep corrosion has been observed and led to product failures in very short service life (1-5 years). Creep corrosion failures within one year of product deployment have also been reported. This has prompted an industry-wide effort to understand creep corrosion
New Equipment | Board Handling - Storage
The Dr.Storage T40W are plug and play, fully auto dry cabinets which can bake at a stable 40℃ and maintain a consistent The T40W Baking Cabinets Series has a double wall design to ensure it maintains a stable According to J-STD-033B, using a T40W
SIPAD Systems Incorporated (SSi) is the Exclusive Supplier of SIPAD solid solder deposit in North America and the only SIPAD Solid Solder Deposit (SSD) coating service bureau in the world. SIPAD Systems Inc. supplies SIPAD solid solder coating servi
