Full Site - : enig solder spattering (Page 3 of 65)

4L-ENIG-PCB

4L-ENIG-PCB

New Equipment |  

FR-4 Material 1. 0 mm Thickness 1oz copper thickness 4 Layers HASL Surface Treatment Green Solder Mask e-test

Shenzhen Longkun Technology Co.,Ltd

Indium Corporation Introduces New Fast-Wetting, Low-Spatter Flux-Cored Wire for Robotic and Laser Soldering

Industry News | 2021-01-21 08:09:52.0

Indium Corporation announces that it is now offering CW-232,a uniquely formulated flux-cored wire that combines superior wetting speed and spread with extremely low-spatter performance.

Indium Corporation

Bicheng Aluminium backed PCB

Bicheng Aluminium backed PCB

Parts & Supplies | Circuit Board Assembly Products

1) 36*36mm/1up, Aluminium type: A5052 2) Thermal conductivity: 0.8-1.3 W/mk, 3) Single sided, 1.6mm 4) White solder mask/ Black Legend 5) Copper weight: 35μm 6) Surface Finish: ENIG 7) Profile: Punch

Bicheng Enterprise Company

BICHENG Gold finger PCB

BICHENG Gold finger PCB

Parts & Supplies | Circuit Board Assembly Products

1). FR-4 Material 2). 2 layer, 1.2mm thick 3). 1 oz copper weight. 4). LPI Green solder mask/White silk screen 5). Gold finger 40 microinch, bevelled. 6). HASL + Gold finger, ENIG + gold finger 7). Larg volum, punch contour.

Bicheng Enterprise Company

Bicheng Bicheng via in pad PCB

Bicheng Bicheng via in pad PCB

Parts & Supplies | Circuit Board Assembly Products

1). 80 *190mm/2up, FR-4 2). 6 layers at 1.4mm thick 3). 35 μm copper weight 4). Green solder mask LPI/White legend 5). ENIG surface finish 6). Blind via from Layer 1 to layer 2 7). Via in pad plugged conductive resin

Bicheng Enterprise Company

WS730 High-Activity, Water Soluble Liquid Flux

WS730 High-Activity, Water Soluble Liquid Flux

New Equipment | Solder Materials

WS730 is a water-based, high activity liquid flux designed to offer low-spattering and excellent wetting, even to difficult-to-solder parts. WS730 is formulated for a variety of electronic, electrical and industrial applications, including wire, cabl

AIM Solder

ENIG FR4 Power supply PCB shenzhen maker

ENIG FR4 Power supply PCB shenzhen maker

New Equipment | Prototyping

4Layer PCB TG≥135 degree PCB thickness: 1.6mm Copper thickness:4OZ Green solder mask White silkscreen Surface treatment: ENIG Min Line/space: 20/20mil Min hole: 28mil Brand Name:SYSPCB

Shenzhen SYS Technology CO., Ltd

eCore Flux-Cored Lead-Free Solder Wire

eCore Flux-Cored Lead-Free Solder Wire

New Equipment | Solder Materials

In August 2007, Nihon Superior started simultaneous worldwide sales of SN100C (030) “eCore,” a resin flux cored, lead-free solder product, which contains the newly developed flux that enables the product to display the distinctive features of SN100C

Nihon Superior Co., Ltd.

Indium Corporation to Feature New Flux-Cored Wire at IPC APEX Expo

Industry News | 2021-02-25 13:23:32.0

Indium Corporation will feature its uniquely formulated flux-cored wire during the virtual IPC APEX Expo, to be held March 8-12.

Indium Corporation

RX18 No Clean Cored Wire Solder

RX18 No Clean Cored Wire Solder

New Equipment | Solder Materials

RX18 no clean flux core wire solder was developed to provide excellent soldering results with all alloys and surface finishes. Engineered for robotic soldering, RX18 promotes thermal transfer, fast wetting and rapid solder penetration into plated thr

AIM Solder


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