New Equipment | Solder Materials
V9 No Clean solder paste is formulated for near-zero voiding on BGA, BTC and LED soldering applications. Significant void reduction achievable on all surface finishes including ENIG, ImSn and OSP. V9 exhibits stable print performance on fine feature
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New Equipment | Solder Materials
LOCTITE GC 10 is a halogen free, zero halogens added, no-clean, low voiding, Pb-free solder paste specially formulated to provide added long term stability over a wide range of temperature conditions. The enhanced paste stability created through its
Electronics Forum | Tue Dec 31 11:48:36 EST 2019 | emeto
Hello experts, I have a 50mmx50mm LGA on a PCBA. I Would like to decrease voiding in these joints and I wanted to hear about your techniques to decrease voiding. Stencil is currently 5mil. SAC305. ENIG finish.
Electronics Forum | Mon Sep 17 14:45:57 EDT 2012 | kkay
We are experiencing voiding on one of our lead-free assemblies on every part. The voiding only occurs underneath the parts and not in the solder fillet (see pic). We have tried baking, curing, washing, multiple pastes and everything else we can think
Industry News | 2024-11-18 19:03:05.0
Stand J90
Industry News | 2015-04-10 15:53:44.0
Blue Thunder Technologies will offer LOCTITE GC 10, named "The Game Changer"
Voiding Control for QFN Assembly Voiding Control for QFN Assembly Quad Flat No Leads (QFN) package designs receive more and more attention in electronic industry nowadays. This package offers a number of benefits including (1) small size
40731 | https://www.smta.org/smtai/SMTAI-2019-Technical-Program.pdf?v=200609010628
Surface Mount Technology Association (SMTA)
