Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Tue Apr 17 10:16:42 EDT 2001 | davef
Welcome to SMTnet. Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!! We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers t
Electronics Forum | Tue Dec 13 22:58:43 EST 2005 | Mike Kennedy
Dave, I have read an article by Vern Solberg who said that Electro plating Ni/Au in not recommended for PCB's. I have tried his email but get bounce back. Do you know him or his email? I knows its a long shot to ask you, but it never hurts to ask...
Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef
For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]
