Electronics Forum | Mon May 11 11:05:08 EDT 2009 | milas
Hi 1. Does anyone know what the pros and cons are of ENIG vs Electroplating ? 2. Is there a likelyhood that in either of these processes the gold can flake off after a period of time ? Thanks in advance Milas
Electronics Forum | Mon Mar 27 09:54:35 EST 2006 | russ
Flash gold is usually to thick and will cause embrittlement of your solder joints if concentration exceeds I beleive 6% in the joint
Electronics Forum | Thu Apr 20 13:42:23 EDT 2006 | fredericksr
I've seen embrittlement %s down to 3%, but a standard 5 mil solder pad would require well over 100uIn of plated gold to cause embrittlement. -Other Russ
Electronics Forum | Wed Jun 03 11:04:32 EDT 2009 | joeherz
Another thing to consider - If you're processing lead free, the nickel layer between the copper and gold provides extra protection against copper dissolution. This is a nice piece of insurance especially when performing rework. Cheers
Electronics Forum | Mon May 11 18:30:10 EDT 2009 | boardhouse
Hi Milas, Here is a link to an artical on the subject. http://pcdandf.com/cms/content/view/4784/95/ The big difference in the to is that ENIG is self limiting where as electroplating is not. All product manufactured with either finish goes throug
Electronics Forum | Wed May 03 22:14:29 EDT 2006 | davef
We think well done carbon ink and well done ENIG are equally reliable [maybe 1M operations]. If the gold is pourous [not all that an uncommon], ENIG is far less reliable than carbon ink.
Electronics Forum | Wed May 03 15:56:25 EDT 2006 | Board House
Hi Patrick, Thank you for the info, We like to push ENIG, for us being the ENIG line is in house it is cheaper to use than the carbon, plus shelf life of the Carbon is an issue in Storage. Pre-application. Thanks again, Mike
Electronics Forum | Thu Jan 09 15:19:41 EST 2014 | davef
For a typical wear surface application [millions of wipes], I agree with hege. You need to be talking electrolytic gold, NOT immersion gold. IPC-2221 says something like ... For edge connectors and areas not to be soldered: * Nickel - 2.5um [~100uin]
Electronics Forum | Thu Dec 14 12:18:01 EST 2000 | genny
Hello all, Our company has always used HASL finish on our products. Recently however, we have a had a problem on a couple of boards that I have been told cannot be avoided with HASL, and we should switch to ENIG(electroless nickel immersion gold).
Electronics Forum | Tue Apr 17 10:16:42 EDT 2001 | davef
Welcome to SMTnet. Awww, those assemblers are always whining about something. Just tell him to shut-up and build the blankin� boards. Jeesh!!! We used to have copious archives on the topic on SMTnet and our friend Brian is working his fingers t
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