Electronics Forum | Mon Aug 16 11:49:44 EDT 2004 | Kris
Hi Guys thanks for the replies. Dave, the spec is not for enig but for hard gold does your response alter if thats the case /
Electronics Forum | Mon Aug 16 16:26:19 EDT 2004 | Kris
what about areas that are soldered ? This is def not a Enig process and the specs are as they are not sure why thanks a lot for your help
Industry News | 2018-10-18 10:16:53.0
Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish
SMTnet Express, August 7, 2014, Subscribers: 23058, Members: Companies: 13975, Users: 36604 Gold Embrittlement In Lead-Free Solder. Craig Hillman, Nathan Blattau, Joelle Arnold, Thomas Johnston, Stephanie Gulbrandsen; DfR Solutions , Julie Silk
ASYMTEK Products | Nordson Electronics Solutions | https://www.nordson.com/de-DE/divisions/efd/resource-center/solder-selection-guide
lötbar Kupfer Verzinkter Stahl Gold Kovar Magnesium Nicht lötbar Baustahl Monel Nichrom Nickel Nickel-Eisen/Legierung42 Nickel-Silber Palladium Platin Silber
Heller Industries Inc. | https://hellerindustries.com/wp-content/uploads/2022/06/Optimizing-Reflowed-Solder-TIM-sTIMs-Processes-for-Emerging-Heterogeneous.pdf
) are similarly used in packages requiring additional reflow cycles. As a contrast to compliant TIMs, gold alloys (for AuSn20, k~57 W/m-K) provide solutions where the bond and alloy are strong enough to deflect the package to absorb thermal strains
