Electronics Forum | Wed Jun 24 16:51:25 EDT 2020 | kumarb
Hi. Taking this from a total different angle - why not use ENIG to avoid this issue but find more competitive suppliers? We source from offshore all the time and finding that due to this dreaded virus - the market pricing is soft. Many are willing to
Electronics Forum | Wed Jun 10 18:44:58 EDT 1998 | Earl Moon
| Okay, here's a stupid question. What exactly is HASL and OSP? We are going to delve into this technology where I work and I want to utilize the wealth of knowledge here to make life easier. Specifically, what are the differences, the advantages, di
Electronics Forum | Wed Jun 10 16:54:46 EDT 1998 | Steve Schrader
| Okay, here's a stupid question. What exactly is HASL and OSP? We are going to delve into this technology where I work and I want to utilize the wealth of knowledge here to make life easier. Specifically, what are the differences, the advantages, di
Electronics Forum | Sat Sep 20 11:44:39 EDT 2003 | Gabriele
Few questions: - wich type of C-CGA ? (CAST or CLASP column to ceramic attach) - column pitch ? - column count ? - capped (with lid) ? or capless (c4 die on top)? - PCB board zize and thickness ? - PCB copper finisch ? (OSP,HASL, ENIG, etc) - v
Electronics Forum | Tue Apr 24 02:56:12 EDT 2007 | chrispy1963
If the PCB you are using is a HASL pad finish and is a leaded assembly, we use homeplate pads with a 5 mil stencil. If the circuit has Enig finish and is PB-Free then we use 1:1 apertures with a 5 mil stencil Either method should provide no solde
Electronics Forum | Thu Dec 11 11:59:23 EST 2008 | joeherz
Update - We've tested a board previously having voiding issues with ENIG versions and the voiding has completely disappeared. No other variables were changed. Looks promising. I have an order of LF HASL boards arriving soon that we plan to split i
Electronics Forum | Tue Jan 04 10:37:48 EST 2011 | johanhuizing
Hi Mike, We only are using ENIG not hard gold, we are using edge contacts but the connectors will only be removed if the product is being replaced, normal life time for the equipment where the electronics is build-in is 15 years. Also the electronic
Electronics Forum | Sat Dec 22 01:34:26 EST 2018 | sara_pcb
My BGA is 0.5mm pitch with Sn66Pb36Ag2 ball. My PCB finish is HASL. Want to do reflow using Eutectic Sn-Pb reflow paste. My Assembly is IPC Class 3 product. 1. Is there any long term reliability issues with 2% Ag in BGA Ball. 2. If the PCB finish
Electronics Forum | Wed Mar 16 15:52:41 EST 2005 | cyber_wolf
Are you using a standard convection reflow oven ? This does not make any sense. I have never heard of anything like this. If you are using a standard oven, then I would say that it is time to get your profiler calibrated.
Electronics Forum | Thu Mar 17 12:51:39 EST 2005 | Slow Ride
How much more? A couple degrees? That would be normal from one board to another, depending if the t-coupls are in the exact same spot etc. What type oven? IR ovens can be affected by colors.
