Electronics Forum | Tue Oct 26 08:41:56 EDT 2004 | Bob R.
When we first got into BGAs on ENIG we were getting joint cracking at in-circuit test. The joints were breaking in the Sn-Ni intermetallic. We did a lot of pull testing while working with our board suppliers and our conclusion was that pull testing
Electronics Forum | Mon Jun 18 21:21:25 EDT 2001 | davef
Two things: 1 A flat surface will probably help the "balls on the socket sliding off the ridge of HASL" problem, but possibly consider less risky choices for your flat surfaces that immersion silver, like: OSP, ENIG, and immersion tin. 2 Don�t throw-
Electronics Forum | Fri Nov 09 16:58:30 EST 2001 | davef
Go for it!!! You were unspecific, but adding mask to a completed board could cause: * Increased paste thickness, if you have double thickness of solder mask. * Wrinkled and lifted solder mask under the component, if the solderability protection of
Electronics Forum | Fri May 10 10:36:09 EDT 2002 | stownsend
Could be. Bottom line is my frustration is high with ENIG. It has it's merits, but if it's not done right, it'll bite you in the butt. Too many other choices to keep this frustration around. I have never used OSP. I'm requesting 200 boards from my b
Electronics Forum | Thu Dec 06 10:15:14 EST 2007 | 18424
I am looking for people that are having problems primarily with test of their product after reflow/production. Has anyone experienced a great solder joint but the component still fails test? Has anyone had dewetting of atmel components, pull back of
Electronics Forum | Tue Nov 03 18:09:17 EST 2009 | gregoryyork
I think most have summed up the first pictures also is the drillng looking like it is misregistered as well. Better to do a solvent test to determine resist cure not the old stuff the newer chemicals show under cure problem much better. Try your st
Electronics Forum | Thu Jun 16 17:02:40 EDT 2011 | boardhouse
The finish looks like Immersion Tin or Silver. if its lead free Hot air - could be issue of to high of a Tin Content. find out what brand of Hasl they are using. SL100 Example. Is this tarnished look only being seen after assembly or have you seen
Electronics Forum | Fri Feb 28 11:02:06 EST 2020 | slthomas
I'm not 100% sure which type of gold you're asking about, but if you're talking about hard gold plating, I think the most common use is to provide a durable surface for things like membrane switch contacts because it resists abrasion and other mechan
Electronics Forum | Thu Apr 14 17:24:06 EDT 2022 | cbart
depends on board finish and PCB substrate materials. If you were using OSP or silver finished bare boards the time to process is less than an ENIG or HASL finished. certain substrate material absorb more moisture than others or at a quicker rate. so
Electronics Forum | Mon Jan 31 16:59:22 EST 2005 | frankracine
Hi Jay, Concerning you PCB, what TG do you expect to use for your lead free process? On my side I have a problem. I order PCB from Canada and from China. My PCB vendor in china is producing a lot of OSP and ENIG PCB, no HASL lead free and in Cana
