Electronics Forum | Mon Aug 16 16:26:19 EDT 2004 | Kris
what about areas that are soldered ? This is def not a Enig process and the specs are as they are not sure why thanks a lot for your help
Electronics Forum | Mon Aug 16 13:18:46 EDT 2004 | davef
You bet our reponse changes. Q2R: Hard gold thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2R: This is a hard gold spec?? It looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. The gol
Electronics Forum | Mon Aug 16 16:37:08 EDT 2004 | davef
As we mentioned in an earlier response in this thread [Q5], you do NOT want to solder to hard gold. Hard gold is a wear surface. [That's IT, that's the LIST.] If you want to solder to gold, then either use: * IPC-4552 ENIG specification, mentioned
Electronics Forum | Wed Aug 11 18:36:03 EDT 2004 | davef
90 Knoop. Q2: Thickness is 4 to 10 u" for Au and 300 to 400 u" for nickel A2: This looks like a ENIG spec. Although, the Ni is quite heavy, 150 uin is sufficient for most applications. [IPC-4552 ENIG specification: * Gold thickness of 0.075 - 0.125
Electronics Forum | Wed Sep 19 16:02:14 EDT 2001 | fcouture
Pad Metallurgy Used: >Is your question about this targeting the current industry capability of using tin plating technology on such small >pad dimensions? Actually I should have asked for tin/lead plating (HASL) and yes it's to have an idea on capab
Electronics Forum | Fri Sep 21 14:45:36 EDT 2001 | jschake
I asked several people their opinion of HASL 0201 pads and there was no positive feedback whatsoever. The most common concern was the domed/convex shape of the pad finish that would result in aperture gasketing problems, which you may already have e
Electronics Forum | Thu Nov 07 10:59:11 EST 2002 | pjc
IPC-7525 "Stencil Design Guidelines" is a good reference document to have. Here are notes from a Tessera, (a major mBGA mfg.), study- "Application Note Solder Stencil Requirement for mBGA" The stencil aperture is to be square, equal in size to the l
Electronics Forum | Wed May 03 15:56:25 EDT 2006 | Board House
Hi Patrick, Thank you for the info, We like to push ENIG, for us being the ENIG line is in house it is cheaper to use than the carbon, plus shelf life of the Carbon is an issue in Storage. Pre-application. Thanks again, Mike
Electronics Forum | Wed May 03 22:14:29 EDT 2006 | davef
We think well done carbon ink and well done ENIG are equally reliable [maybe 1M operations]. If the gold is pourous [not all that an uncommon], ENIG is far less reliable than carbon ink.
Electronics Forum | Thu Dec 14 19:38:28 EST 2000 | Dave F
OK, now let me ask the really dopey question ... so if the irregularity of the HASL surface is punching holes in the thermal gasket and causing shorts to the heat sink, why are you putting solder on that surface? I wonder how the thermal conductivit
