Technical Library | 2019-02-20 16:35:24.0
The High Density Packaging (HDP) User Group has completed a project evaluating the high frequency loss impacts of a variety of imaged core surface treatments (bond enhancement treatments, including chemical bonding and newer low etch alternative oxides) applied just prior to press lamination. Initial high frequency Dk/Df electrical test results did not show a strong correlation with any of the methods utilized within this project to measured surface roughness. The more significant factor affecting the measured loss is the choice of pre-lamination surface treatment. Most of the new chemical treatment systems outperform the older existing systems which depend upon surface roughness techniques to promote adhesion.
Industry News | 2020-09-06 04:53:14.0
MacDermid Alpha Electronics Solutions will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
Industry News | 2020-09-10 11:09:50.0
MacDermid Alpha Electronics Solutions, a global leader in high performance semiconductor chemistries and assembly materials, will exhibit its total process solutions for emerging packaging at the Semicon Taiwan, Taipei City, September 23-25, 2020.
Industry News | 2021-03-31 17:56:27.0
MacDermid Alpha Electronics Solutions will be a Supporting Partner at the upcoming IMAPS Device Packaging Conference being held virtually from April 12-15, 2021. MacDermid Alpha will highlight their entire portfolio of technologies from their MacDermid Enthone, Alpha, Kester, and Compugraphics brands essential to advanced semiconductor packaging and the markets it enables.
Career Center | Suwanee, Georgia USA | Research and Development
Alpha Advanced Materials, a business unit of Alent plc and the global leader in the development, manufacturing and sales of innovative specialty materials used in a wide range of industry segments, including electronics assembly, power electronics, d
Industry News | 2021-12-13 12:52:59.0
MacDermid Alpha Electronics Solutions will be exhibiting at the Taiwan Printed Circuit Association (TPCA) exhibition and will present at the IMPACT Conference, co-located with TPCA at the Nangang Exhibition Center Taipei, Taiwan, December 21-23, 2021.
Industry News | 2020-12-01 02:54:29.0
MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.
Industry News | 2022-09-05 06:53:02.0
MacDermid Alpha Electronics Solutions will exhibit its total process solutions for the emerging semiconductor market at Semicon Taiwan, Taipei City, September 14-16, 2022 at Taipei Nangang Exhibition Center, Hall 1 (TaiNEX 1).
Industry News | 2020-11-12 10:25:20.0
MacDermid Alpha Electronics Solutions will be exhibiting at the International Electronics Circuit Exhibition hosted by the Hong Kong Printed Circuit Association.The show will be held from December 2-4, 2020 at the Shenzhen Convention and Exhibition Center,China.
Industry News | 2021-04-15 12:17:37.0
MacDermid Alpha Electronics Solutions announces the release of ALPHA CVP-390Vhigh reliability solder paste, designed to maximize flexibility in manufacturing and provide excellent electrochemical reliability in harsh operating conditions.
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