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MacDermid Alpha to Feature Latest Low Temperature Solutions at SMTA Guadalajara and SMTA Empire Expos

Industry News | 2022-09-19 05:50:39.0

MacDermid Alpha to Feature Latest Low Temperature Solutions at SMTA Guadalajara and SMTA Empire Expos

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Present Next Generation Assembly & Interconect Technologies for 3D In-Mold Electronics at TechBlick 2022

Industry News | 2022-10-04 11:23:40.0

MacDermid Alpha Electronics Solutions will present the technical paper 'Next Generation Assembly and Interconnect Technologies for Smart Structures and Functional Surfaces' at the TechBlick Conference and Expo taking place October 12-13 in Eindhoven, Netherlands.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Present Automotive Traction Module Attach by Silver Sintering at IEMT Conference 2022

Industry News | 2022-10-06 18:58:55.0

MacDermid Alpha Electronics Solutions will present the technical paper: "Automotive Traction Module Attach by Silver Sintering - Process, Performance & Reliability" at the 39th International Electronics Manufacturing Technology (IEMT) Conference from October 19 - 21 in Putrajaya, Malaysia.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Launches Ultra-Low Temperature Solder and 5G Solutions at Productronica China 2020

Industry News | 2020-06-24 15:22:46.0

The Assembly Solutions division of MacDermid Alpha Electronics Solutions will be introducing its ultra-low temperature solder and 5G solutions at the Productronica China show from July 3-5, 2020, at the National Exhibition and Convention Center in Shanghai.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Present Void Reduction and Silver Free Alloy Solutions at SMTA South China Technology Conference in Shenzhen

Industry News | 2020-08-22 04:19:37.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting two technical papers; "Methods of Reducing or Eliminating Voids in BGA and BTC Devices" and "Can Low Cost Silver Free Alloys Be Used in Type II and III Assemblies?" at the SMTA China South Technical Conference taking place from August 26-27 in Shenzhen, China.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Presents 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at SNEC 2021 in Shanghai, China

Industry News | 2021-05-21 03:59:59.0

The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting a technical paper: 'Advantages of Prefluxed Ribbon-wire in Multi busbar Interconnection' at the SNEC 15th(2021) International Photovoltaic Power Generation and Smart Energy Conference &Exhibitiontaking placein Shanghai, China on June 2-5,2021.

MacDermid Alpha Electronics Solutions

MacDermid Alpha Electronics Solutions Expands Market Presence in Israel with New Channel Partnership

Industry News | 2023-06-26 09:33:10.0

MacDermid Alpha is pleased to announce its Channel Partnership Agreement with Amza Ltd. This strategic alliance commences with immediate effect and marks a significant milestone for both companies as they join forces to expand the distribution and sales of the Alpha® branded range of solder pastes, preforms, cored wires, and flux products across Israel, Gaza, and the West Bank area.

MacDermid Alpha Electronics Solutions

IPC 4104/21 MATERIAL

Electronics Forum | Thu Jun 09 21:45:23 EDT 2005 | davef

We don't know, but we'd contact Enthone-OMI [ http://www.enthone-omi.com ] for suggestions. Enthone makes materials used by fabricators of HDI, microvia boards.

Entek PCB requirement

Electronics Forum | Thu Sep 15 19:58:35 EDT 2005 | davef

Shikoku Glicoat SMD process is the market share leader for LF OSP in Japan and the Asian Rim. Enthone Entek is more of a US / Euroland product. Beyond that, it's not clear that Enthone has kept pace with product development necessary to compete in L


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