Electronics Forum | Fri Jan 02 08:10:18 EST 2009 | childs
Thanks for the reply Stephen. The time factor sounds logical for moisture invasion during cleaning, probably why there's no articles showing concern about the process. I did try experimenting with some samples and believe it or not could not dupli
Electronics Forum | Tue May 11 14:17:55 EDT 2010 | isd_jwendell
Getting the paste from the jar and into the cartridge without entrapping air can be difficult. Can you not just transfer the 500g jar into smaller working jars? This way you can keep the bulk of your paste refrigerated until needed. Air is not your f
Electronics Forum | Mon Jul 04 14:21:14 EDT 2011 | davef
The three primary causes for bubble generation in solvent-based coatings are: * Air entrapment * Solvent flash-off * Curing the coating too quickly Tell us more about your process including: * When you first notice the bubbles * Extent of the probl
Electronics Forum | Thu Dec 12 17:39:14 EST 2019 | davef
When I hear "pinholes" in solder connections, I think of two sources, depending on the situation, which can be either: + Entrapped air and process chemicals develop during reflow soldering to cause the pinholes in and around the intermetallic layer
Electronics Forum | Mon Oct 12 17:28:39 EDT 2020 | rgduval
Check the microphone data sheet to find out what the max temperature is...if it's not listed, call the manufacturer. Are you water-washing the board after assembly? Could be water intrusion/entrapment in the microphone. Again, check the data she
Electronics Forum | Tue Jul 06 14:23:27 EDT 1999 | Earl Moon
| | | I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | | | | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so,
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Tue Feb 22 14:20:55 EST 2000 | Sal
Please let me rephrase the question. Running passive side first and curing the adhesive using a reflow profile derived for 63/37 solder paste. After curing the board is flipped around, pasted and reflowed. My concern is when curing the adhesive usin
Electronics Forum | Tue Nov 28 21:03:48 EST 2000 | Dave F
Getting people to stop sounds like a good idea, but once they get running after a lengthy set-up, you can sort of understand why they don't want to stop when they quickly run out of paste after emptying a partially filled tube. Beyond the paste qual
Electronics Forum | Thu Mar 23 08:34:45 EST 2000 | Shane Lay
Dave, Thank you for the information. We will be conducting several tests in the near future that will evaluate the corrosion/contamination response as it is our primary concern once we remove our aqueous processes. We are well aware of the effects
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