Electronics Forum | Tue Jul 06 14:23:27 EDT 1999 | Earl Moon
| | | I've heard that use of VOC free flux with wavesolder fixtures can be challenging due to entrapment of water in the fixture. | | | | | | Is anyone out there successfully running VOC free with wave fixtures & did you experience problems? If so,
Electronics Forum | Mon Dec 22 16:02:22 EST 1997 | Justin Medernach
| what is your experience about the presence of the voids in the joints ? | Are they dangerous and when ? Vincenzo, Voids in solder joints can be caused by a number of factors. Let's begin with the flux vehicle in your soldering media. If the prope
Electronics Forum | Tue Feb 22 14:20:55 EST 2000 | Sal
Please let me rephrase the question. Running passive side first and curing the adhesive using a reflow profile derived for 63/37 solder paste. After curing the board is flipped around, pasted and reflowed. My concern is when curing the adhesive usin
Electronics Forum | Tue Nov 28 21:03:48 EST 2000 | Dave F
Getting people to stop sounds like a good idea, but once they get running after a lengthy set-up, you can sort of understand why they don't want to stop when they quickly run out of paste after emptying a partially filled tube. Beyond the paste qual
Electronics Forum | Thu Mar 23 08:34:45 EST 2000 | Shane Lay
Dave, Thank you for the information. We will be conducting several tests in the near future that will evaluate the corrosion/contamination response as it is our primary concern once we remove our aqueous processes. We are well aware of the effects
Electronics Forum | Tue Feb 22 14:20:55 EST 2000 | Sal
Please let me rephrase the question. Running passive side first and curing the adhesive using a reflow profile derived for 63/37 solder paste. After curing the board is flipped around, pasted and reflowed. My concern is when curing the adhesive usin
Electronics Forum | Tue Jan 16 13:47:24 EST 2001 | cebukid
10% on various BGA packages. I checked the profile and we are getting "ideal" reflow conditions (~ 60 sec. T.A.L.). Ramp rates, temperature deltas before spike zone, and cooling rates are ideal too. I don't believe it's a profile, print, or paste
Electronics Forum | Mon Jul 16 15:49:33 EDT 2001 | Steve
The solder balls you are talking about are caused by too much paste. Reduce the size of the stencil aperatures. Concerning removing the solder balls, the first thing you need to ask yourself is, do I need to remove them. IPC-610, 12.4.10 states, "Ac
Electronics Forum | Sat May 29 16:04:49 EDT 1999 | M Cox
I have always thought it to be a good practice to wash SMA's with water soluble paste (WS609) soon after reflow. Is there a time limit as to how long a board should sit after reflow before washing said board? For instance; processing a double-sided
Electronics Forum | Wed Oct 03 17:06:43 EDT 2001 | davef
Yes, moisture entrapment causes solder shorts 80% of the time. Cracks occur bottom side of the BGA. Use an acoustic microscope to find the cracks. So, what makes you think your BGA are blowing-off steam? I posted a vid on SMTnet that showed the b
