Electronics Forum | Wed Oct 02 12:06:59 EDT 2002 | dragonslayr
Scott - all sounds good. My primary concern is the residual flux left behind under the BGA. Will moisture entrapment become a concern over time? I believe that may be dependent on the flux formulation. I know that some no clean fluxes actually become
Electronics Forum | Thu Dec 05 11:36:30 EST 2002 | William Guatemala
Have you check the flux gravity lately? If not, Check the flux gravity every 6 hours to make sure proper parameters are meet. Here is a list of things that may cause your solder ball problems; Excecive heat, defective fixtures, preheating temperature
Electronics Forum | Mon Dec 09 20:50:08 EST 2002 | MA/NY DDave
Hi I kind of agree without any reliability studies. Where are the Ionics coming from? After Soldering depending on chemistry I think we agree? Yet these are bare boards after many processes and even testing that should scrub out or off the Ionics.
Electronics Forum | Tue Apr 13 10:30:52 EDT 2004 | Ken
Threre has been speculation as to voiding as a function of solder paste liquiduous vs. ball liquiduous. Gas entrapment is thought to result if one melts before the other (I forget which order). Two profiles may yield different results as determined
Electronics Forum | Fri Aug 04 06:27:15 EDT 2006 | CL
Good Morning Everyone, We have started limited production runs of RoHS assemblies. Most of them are prototypes for our customers that are converting to Lead Free. We have seen on several assemblies, solder beads under the chip components that are en
Electronics Forum | Fri Jul 13 18:25:09 EDT 2007 | seankim10
It sounds like more has to do with plating. you may also check out the voiding issue especially if you have new FAB or the supplier. I had problems with a RF chip in QFN package due to insufficient grounding that voiding caused. This ground is often
Electronics Forum | Thu Jan 15 03:20:59 EST 2009 | sachu_70
Hi Andrzej, I guess you mean peelable solder resist. Good idea to try during R&D, but certainly not a solution on production floor. Also, few constraints to be considered such as presence of entrapped air between component and solder resist, the natu
Electronics Forum | Fri Aug 28 05:07:59 EDT 2009 | sachu_70
Do you clean the stencil manually or using the automated under-stencil cleaner on your Printer (recommended)? 1. Ensure that stencil wipes are lint-free and soaked sufficiently with solvent before use. 2. If your printer supports automated cleaning
Electronics Forum | Mon Jan 04 21:03:22 EST 2010 | cman
1) I'm not familiar with the acronym CAF. Could you spell that one out for me? 2)Why do you feel they need to be baked? Are they in a high humidity enviornment? the only time we bake is when we are dealing with moisture sensitive components. Do you b
Electronics Forum | Thu Mar 25 11:30:33 EDT 2010 | Sean
Hello Rajeshwara, If not mistaken, the 25% solder void specification is for BGA...As I I as know, no specification given to mosfet component yet..I think you are right, I need to look at the stencil aperture in order to reduce the air trap underneat
