splice tape, which allow to join the carrier tape without shutting off the machine. clean wiper, high entrapment and low lint and high absobency. label, anti-eletronic and weather-proof and good resistant to solvent and high temperature.
splice tape, which allow to join the carrier tape without shutting off the machine. clean wiper, high entrapment and low lint and high absobency. label, anti-eletronic and weather-proof and good resistant to solvent and high temperature.
Technical Library | 2021-08-11 00:52:35.0
Formulators of multi-component adhesives, potting and encapsulation materials are careful not to supply products with entrapped air. They do this by manufacturing under vacuum or degassing them before supplying to the end user. Consequently, entrapped air in a mixed material is usually a processing issue.
Technical Library | 2021-12-31 06:55:24.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
Technical Library | 2021-12-31 06:56:02.0
Any air entrapment in the potting compound can result in air bubbles that may cause performance problems in the finished component. Potting under vacuum is therefore frequently required to prevent air entrapment, especially with the increasingly small and complex assemblies required in today's electronics
using our splice tape for SMT, which guarantee perfect and reliable joints in punched carrier tapes without shutting off the machine 1)high efficiency 2)reducing SMT machine and feeder abrasion: 3)energy saving 4)make full use of component in the car
using our splice tape for SMT, which guarantee perfect and reliable joints in punched carrier tapes without shutting off the machine 1)high efficiency 2)reducing SMT machine and feeder abrasion: 3)energy saving 4)make full use of component in the car
Technical Library | 1999-04-15 06:54:01.0
High-speed printing techniques are revealed that break the speed barrier resulting from air entrapment in large apertures at fast squeegee speeds. Adhesive printability test results using conventional thickness stencils to achieve a significant range of d
Technical Library | 2018-08-23 07:47:57.0
Simply put, the proper system design and use of vacuum in the potting process can make the difference between a mediocre part and a perfect part. Air entrapment is inevitable whether you utilize syringes, cartridges, pails, or drums of material in the process.
Lite Fast 2081, a UV encapsulant, was specifically developed to relieve the stress placed on toroidal coils or electronic components that will experience pressure during the molding process. With a durometer Shore D hardness of 5, the UV encapsulant
